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Thermal Evaluation and Cost-Effective Optimization of Hybrid Three-Level Si/SiC ANPC Converters to Expand the Power Capacity Limitation
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DOI：10.1109/tpel.2026.3697305.png)
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Abstract
En 中文
Hybrid Si/SiC converters offer a favorable balance between performance and cost and are promising for renewable energy applications. However, their power capacity is fundamentally limited by thermal constraints, and a systematic approach to expand this limit in a cost-effective manner is still lacking. This article investigates the power-capacity limitation of hybrid Si/SiC three-level active neutral-point clamped (ANPC) converters through a quantitative electrothermal analysis. The power loss distribution and junction-temperature characteristics of Si IGBTs and SiC <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small>s are analyzed under different switching frequencies, load conditions, and power factors, enabling the identification of dominant thermal bottlenecks. Based on this analysis, a thermal-limited power-capacity boundary is derived under junction-temperature and efficiency constraints, accounting for the combined effects of operating conditions and device thermal stress. To further enhance the achievable power capacity, a cost-effective device-rating configuration methodology is proposed by introducing the relative capacity of SiC <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small>s as a key design variable. The proposed method redistributes power losses and thermal stress between Si IGBTs and SiC devices, improving thermal utilization without proportionally increasing device count. Experimental results demonstrate that the proposed approach achieves a 100% increase in power capacity with a peak efficiency of 98.7%, while reducing system cost by 24% compared with conventional approaches. This article provides a practical and systematic solution for enhancing the power capacity of hybrid Si/SiC ANPC converters under thermal and efficiency constraints.
Keywords:
Cost-effective optimization
hybrid Si/SiC topology
power capacity limitation
thermal evaluation
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