logo
CanyamAI summaries for academic research
language
MobileMobile
  • Phone FeatureWeChat Mini Program
EnglishEnglish
noticeNotice
BlogBlog
delete
arrow
Return

Thermal layout optimization for 3D stacked multichip modules

delete2023-09-01
delete0
PRE
AI
DOI：10.1016/j.mejo.2023.105882delete
deleteOriginal
deleteOriginal request for help
deleteShare
deleteSave
Abstract

Abstract

En

Journal

No journal information available

Organization

No organization information available
Cited Papers

Cited Papers

No cited papers available