Thermal transport and accommodation coefficient at the air-MoS2 interface

2025-05-16

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Dongsheng Li

Xiaona Huang *

Dezhao Huang

Nan Zhang

Dongmei Liao

Zhaofu Zhang

Shijing Wu

Yue, Yanan *

DOI：10.1063/5.0270995

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Heat conduction between air molecules and solid interfaces is substantial for thermal management in nanoelectronics devices. Such a process, governed by collisions between air molecules and the surface, is ascribed to the thermal accommodation coefficient (TAC). However, quantifying the TAC in miniaturized devices remains a significant challenge due to the limitation of measuring at small scales. Here, we characterized the heat conduction between air molecules and few-layer MoS2 at various temperatures using Raman spectroscopy, revealing several orders of magnitude higher values than bulk surfaces. The equivalent heat convection coefficient decreases from 9.35 x 10(4) to 7.09 x 10(4) W/m(2)K for temperatures ranging from 308 to 345 K. In addition, the TAC values are further determined based on the kinetic theory of air molecules, with the values decreasing from 0.88 to 0.71 as temperature increases. This is attributed to the increased kinetic energy mismatch between air molecules and the solid surface at higher temperatures. These findings deepen our understanding of heat conduction at the air-MoS2 interface and provide valuable insights for advancing thermal management strategies in nanoscale electronic devices.

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Thermal transport and accommodation coefficient at the air-MoS2 interface

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