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Thermodynamics-guided optimization and mechanistic insights for controlled electroless copper plating on β-SiC particles
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DOI：10.1016/j.surfcoat.2026.133685.png)
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Abstract
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• A thermodynamics-guided electroless plating strategy is developed for high-quality copper coating on β-SiC particles. • EDTA effectively stabilizes Cu2+ above pH 10.5, while suppressing Cu(OH)2/CuO precipitation. • Optimal plating conditions (60 °C, pH 12.0, 8 g/L CuSO4·5H2O, 10 mL/L HCHO) yield dense, uniform, adherent coatings with core-shell structures. • Copper grows epitaxially along β-SiC (111) planes, exhibiting strong (111) preferred orientation and enhanced interfacial integrity. • A “complexation-catalytic nucleation-epitaxial growth” mechanism is established, revealing the role of Ag catalysts and lattice-matched growth.
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6.1
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2.8W
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