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Three-dimensional integrated stretchable electronics

delete2018-08-13
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PRE
AI
Z
Zhenlong Huang
Y
Yifei Hao
Y
Yang Li
H
Hongjie Hu
C
Chonghe Wang
A
Akihiro Nomoto
T
Taisong Pan
Y
Yue Gu
陈怡沐 (Yimu Chen)
T
Tianjiao Zhang
W
Weixin Li
雷雨声 (Yusheng Lei)
N
Nam-Heon Kim
王春凤 (Chunfeng Wang)
L
Lin Zhang
J
Jeremy W. Ward
A
Ayden Maralani
X
Xiaoshi Li
M
Michael F. Durstock
A
Albert P. Pisano
Y
Yuan Lin
S
Sheng Xu *
DOI:10.1038/s41928-018-0116-ydelete
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Abstract

Abstract

En 中文
Stretchable electronics is an emerging technology that creates devices with the ability to conform to nonplanar and dynamic surfaces such as the human body. Current stretchable configurations are constrained to single-layer designs due to limited material processing capabilities in soft electronic systems. Here we report a framework for engineering three-dimensional integrated stretchable electronics by combining strategies in material design and advanced microfabrication. Our three-dimensional devices are built layer by layer through transfer printing pre-designed stretchable circuits on elastomers and creating vertical interconnect accesses using laser ablation and controlled soldering. Our approach enables a higher integration density on stretchable substrates than single-layer approaches and allows new functionalities that would be difficult to implement with conventional single-layer designs. Using this engineering framework, we create a stretchable human-machine interface testbed that is based on a four-layer design and offers eight-channel sensing and Bluetooth data communication capabilities.
Keywords:
TRANSPARENT
INTERCONNECTS
FABRICATION
DESIGN
DEVICE
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Journal

Nature Electronics cover
Nature Electronics
IF:
40.9
Papers:
1.7K
Citations:
2.1W

Organization

T
tianjin university
Scholars:
7.8W
Papers: 5.7W
Citations: 88
Z
Zhengzhou University
Scholars:
6.8W
Papers: 4.4W
Citations: 8.5W
University of California System cover
University of California System
Scholars:
37.5W
Papers: 33.7W
Citations: 6.6K
U
University of California San Diego
Scholars:
4.6W
Papers: 3.5W
Citations: 924
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