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Three-dimensional printing of soft hydrogel electronics

delete2022-12-19
delete98
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OA
AI
Y
Yue Hui *
Y
Yuan Yao
Q
Qilin Qian
J
Jianhua Luo
H
Hehao Chen
Q
Qiao Zheng
Y
Yetian Yu
L
Liang Tao *
Z
Zhou, Nanjia *
DOI:10.1038/s41928-022-00887-8delete
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Abstract

Abstract

En 中文
Electronics based on hydrogels can have inherent similarities to biological tissue and are of potential use in biomedical applications. Ideally, such hydrogel electronics should offer customizable three-dimensional circuits, but making complex three-dimensional circuits encapsulated within a hydrogel matrix is challenging with existing materials and manufacturing methods. Here we report the three-dimensional printing of hydrogel electronics using a curable hydrogel-based supporting matrix and a stretchable silver-hydrogel ink. The supporting matrix has a yield stress fluid behaviour, so the shear force generated by a moving printer nozzle creates a temporary fluid-like state, allowing the accurate placement in the matrix of silver-hydrogel ink circuits and electronic components. After printing, the entire matrix and embedded circuitry can be cured at 60 degrees C to form soft (Young's modulus of less than 5 kPa) and stretchable (elongation of around 18) monolithic hydrogel electronics, whereas the conductive ink exhibits a high conductivity of around 1.4 x 10(3) S cm(-1). We use our three-dimensional printing approach to create strain sensors, inductors and biological electrodes.

Journal

Nature Electronics cover
Nature Electronics
IF:
40.9
Papers:
1.7K
Citations:
2.1W

Organization

H
Hangzhou Dianzi University
Scholars:
1.3W
Papers: 9.5K
Citations: 7.5K
W
westlake university
Scholars:
5.3K
Papers: 3.7K
Citations: 8
N
National University of Singapore
Scholars:
7.5W
Papers: 6.4W
Citations: 11.4W
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