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Toughened BMI film adhesives for cryo-to-high temperature aerospace applications
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DOI：10.1080/01694243.2026.2684747.png)
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Abstract
En 中文
Bismaleimide-based film adhesives were designed and developed to offer significantly improved bond performance over wide temperature spans, ranging from cryogenic conditions (−196 °C) to 250 °C. Toughening of 4,4′-bismaleimidodiphenyl methane (BMPM) based resin formulation has been accomplished by chain extension involving 2,2’-diallylbisphenol A (DABA) and reactive core-shell rubber (CSR) particles. The curing behaviour was monitored by spectroscopic and thermal techniques. Introduction of a novolac epoxy resin enhanced the adhesion and influenced the glass transition temperature (Tg) and thermal stability of corresponding co-cured networks. Further improvement in adhesive strength was achieved by including tetrafunctional epoxy resin (TFE), with a concomitant enhancement in Tg to 245 °C. The optimized adhesive composition exhibited lap shear strengths of 12 MPa at −196 °C, 15 MPa at 30 °C, 23 MPa at 200 °C, and 13 MPa at 250 °C. The adhesive retains 86% of its original strength even at 250 °C. Homogeneous, single-phase co-cured networks have been established as evidenced by dynamic mechanical analysis (DMA) and field emission scanning electron microscopy (FESEM). These results show that the film adhesive reported in this study is a potential structural adhesive for high-performance applications with excellent strength and stability over a wide temperature range of (−196 °C) to 250 °C.
Keywords:
Bismaleimide
film adhesive
thermal stability
lap shear strength
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3.7
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