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Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging
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DOI：10.1016/j.compositesa.2025.108757.png)
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Abstract
En 中文
Packaging materials are crucial for chip performance, directly impacting heat dissipation, warpage, and signal quality. However, balancing flowability and solid content often limits their effectiveness. Herein, a novel methodology is developed for creating ultrahigh-solid-content liquid molding compounds (LMCs) with low viscosity and exceptional properties. By establishing a mathematical model that accurately predicts composites' viscosity and optimal maximum packing density based on binary size-distributed samples, achieving 78.0 vol% LMC. Its excellent flowability enables superior processability, with precise thickness control and low surface roughness on wafer coatings. The low thermal expansion coefficient (alpha 1 = 11.4 ppm degrees C-1) ensures minimal warpage and strong adhesion. Dielectric properties (Dk/Df = 2.62/0.0062) significantly lower than commercial FR-4 materials are reached. Besides a high flexural strength of 142.2 MPa, the 78 vol% LMC demonstrates thermal conductivity (1.33 W m-1 K-1) closely approaching pure silica. These outstanding properties highlight the practicality of the ultrahigh-solid-content LMCs for advanced wafer-level packaging applications.
Keywords:
Epoxy composites
Rheology properties
Liquid molding compounds
Semiconductor packaging
Thermal conductivity
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