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Understanding into the Microstructure and Diffusion Behaviors of Water Removal in Nanopores of Wafer by Supercritical Carbon Dioxide: Experiment and Molecular Dynamics Simulation
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DOI:10.1016/j.supflu.2025.106791.png)
Abstract
En 中文
• Residual water removal within nanostructure with scCO2 was investigated. • IPA contributes to the better dispersion and dissolution of water droplet. • IPA molecules form ordered layers that reducing water-surface adhesion. • The drying efficiency shows distinct feature-size dependence.
Journal
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4.4
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5.6K
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1.3W
