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Vertically aligned boron nitride-confined solid-solid phase-change composites for electronic thermal management
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DOI：10.1016/j.compositesa.2026.110173.png)
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Abstract
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• This work reports a solvent-free, vertically aligned BN-confined solid-solid PCM. • PUPCM@2CBNA achieves a through-plane thermal conductivity of 1.672 W/mK at only 17.4 wt% BN. • BN confinement and polymer crosslinking preserve 112.1 J/g latent heat, prevent leakage, and ensure cycling stability. • Chip-level integration lowers operating temperature by up to 34.6 °C, demonstrating practical cooling efficacy.
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