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Shijo Nagao

the university of tokyo

46H-index
256Paper Count
6.1KCitation Count
Published Papers 61
Publication Date
Measurement of Λ Polarization in the π ¯  p → K0 Λ Reaction at pπ¯ = 1.33 GeV/c toward a New Λ p Scattering Experiment
err2025-12-01
err0
errOAAI
errT Sakao; K Miwa; J K Ahn; Y Akazawa; T Aramaki; S Ashikaga; S Callier; N Chiga; S W Choi; H Ekawa; P Evtoukhovitch; N Fujioka; M Fujita; T Gogami; T Harada; S Hasegawa; S H Hayakawa; R Honda; S Hoshino; K Hosomi; M Ichikawa; Y Ichikawa; M Ieiri; M Ikeda; K Imai; Y Ishikawa; S Ishimoto; W S Jung; S Kajikawa; H Kanauchi; H Kanda; B M Kang; H Kawai; S H Kim; T Kitaoka; K Kobayashi; T Koike; K Matsuda; Y Matsumoto; S Nagao; R Nagatomi; Y Nakada; M Nakagawa; I Nakamura; T Nanamura; M Naruki; S Ozawa; L Raux; T G Rogers; A Sakaguchi; H Sako; S Sato; T Shiozaki; K Shirotori; K N Suzuki; S Suzuki; M Tabata; C d L Taille; H Takahashi; T Takahashi; T N Takahashi; H Tamura; M Tanaka; K Tanida; Z Tsamalaidze; M Ukai; H Umetsu; S Wada; T O Yamamoto; J Yoshida; K Yoshimura; null
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In situ nanoelectromechanical characterization of phase transformation in Si phononic crystal during nanoindentation
err2021-10-21
err1
errOAAI
errFujikane, Masaki; Takahashi, Kouhei; Tambo, Naoki; Kozaki, Takashi; Nagao, Shijo
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Room-Temperature Plasticity of a Nanosized GaN Crystal
err2021-07-27
err10
errOAAI
errFujikane, Masaki; Nagao, Shijo; Chrobak, Dariusz; Yokogawa, Toshiya; Nowak, Roman
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Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip
err2021-05-01
err54
PREAI
errKim, Dongjin; Nagao, Shijo; Chen, Chuantong; Wakasugi, Naoki; Yamamoto, Yasuyuki; Suetake, Aiji; Takemasa, Tetsu; Sugahara, Tohru; Suganuma, Katsuaki
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Reactive wafer bonding with nanoscale Ag/Cu multilayers
err2020-07-01
err12
PREAI
errLiu, Yu-chen; Lin, Shih-kang; Zhang, Hao; Nagao, Shijo; Chen, Chuantong; Suganuma, Katsuaki
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Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining
err2019-10-31
err22
errOAAI
errKim, Dongjin; Yamamoto, Yasuyuki; Nagao, Shijo; Wakasugi, Naoki; Chen, Chuantong; Suganuma, Katsuaki
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Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion
err2019-09-20
err4
PREAI
errIwashige, Tomohito; Endo, Takeshi; Sugiura, Kazuhiko; Tsuruta, Kazuhiro; Sakuma, Yuichi; Oda, Yukinori; Chen, Chuantong; Nagao, Shijo; Sugahara, Tohru; Suganuma, Katsuaki
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Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size
err2019-08-01
err33
errOAAI
errZhang, Zheng; Chen, Chuantong; Liu, Guiming; Li, Caifu; Kurosaka, Seigo; Nagao, Shijo; Suganuma, Katsuaki
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Ag particles for sinter bonding: Flakes or spheres?
err2019-06-27
err46
PREAI
errYeom, Jeyun; Nagao, Shijo; Chen, Chuantong; Sugahara, Tohru; Zhang, Hao; Choe, Chanyang; Li, Cai-Fu; Suganuma, Katsuaki
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Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles
err2019-04-23
err13
PREAI
errSugiura, Kazuhiko; Iwashige, Tomohito; Tsuruta, Kazuhiro; Chen, Chuantong; Nagao, Shijo; Sugahara, Tohru; Suganuma, Katsuaki
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Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
err2019-04-01
err121
errOAAI
errZhang, Zheng; Chen, Chuantong; Yang, Yang; Zhang, Hao; Kim, Dongjin; Sugahara, Toru; Nagao, Shijo; Suganuma, Katsuaki
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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
err2018-12-01
err91
errOAAI
errGao, Yue; Li, Wanli; Chen, Chuantong; Zhang, Hao; Jiu, Jinting; Li, Cai-Fu; Nagao, Shijo; Suganuma, Katsuaki
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Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate
err2018-10-01
err44
PREAI
errSun, Fu-Long; Gao, Li-Yin; Liu, Zhi-Quan; Zhang, Hao; Sugahara, Tohru; Nagao, Shijo; Suganuma, Katsuaki
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Bonding technology based on solid porous Ag for large area chips
err2018-03-01
err64
errOAAI
errChen, Chuantong; Noh, Seungjun; Zhang, Hao; Choe, Chanyang; Jiu, Jinting; Nagao, Shijo; Suganuma, Katsuaki
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Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution
err2017-09-01
err40
errOAAI
errWang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki
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Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
err2017-05-01
err83
PREAI
errChen, Chuantong; Nagao, Shijo; Suganuma, Katsuaki; Jiu, Jinting; Sugahara, Tohru; Zhang, Hao; Iwashige, Tomohito; Sugiura, Kazuhiko; Tsuruta, Kazuhiro
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