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S

Saurabh Khuje

university of maryland

13H-index
42Paper Count
599Citation Count
Published Papers 25
Publication Date
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A molecular pathway to corrosion-resistant printable copper
errScience
IF45.8
err2026-05-14
err0
PREAI
errJun Zhang; Qiubo Zhang; Qikun Feng; Xiao Sun; Lin Xu; Zhongxuan Wang; Xueying Zheng; Linlin Yang; Saurabh Khuje; Haimei Zheng; Liangbing Hu; Shenqiang Ren
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Pyrolyzed preceramic precursors to compositionally complex ceramics
errMatter
IF17.5
err2025-07-21
err0
errOAAI
errSaurabh Khuje; Jiayue Sun; Chong Yang; Zhongxuan Wang; Long Zhu; Tangyuan Li; Gianna Valentino; Nicholas Ku; Andres Bujanda; Jian Yu; Tucker Moore; Taylor J. Woehl; Liangbing Hu; Shenqiang Ren
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Three-Dimensional Porous Copper Conductive Paper
errNANO LETTERS
IF9.1
err2025-05-27
err0
PREAI
errLi, Zheng; Ge, Xiaoli; Rumsey, Clayton L.; Zhang, Jun; Feng, Qikun; Wang, Zhongxuan; Khuje, Saurabh; Islam, Abdullah; Gogoi, Pratahdeep; Trebbin, Martin; Li, Yuguang C.
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errSave
Polyaramid Conductive Paper for Joule Heating and Electromagnetic Interference Shielding
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2025-02-17
err0
PREAI
errKhuje, Saurabh; Islam, Abdullah; Ren, Shenqiang
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errSave
Hierarchical Biogenic-Based Thermal Insulation Foam
errACS NANO
IF16
err2024-12-31
err0
PREAI
errMeng, TT; Zhu, L; Kriney, H; Taylor, A; Khuje, S; Islam, T; Zhang, C; Ren, SQ
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errSave
Copper-Coated E-Glass Fiber-Based Strain Sensors for High Temperatures
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-11-07
err0
PREAI
errKhuje, Saurabh; Zhu, Long; Yu, Jian; Ren, Shenqiang
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errSave
Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-09-16
err0
PREAI
errKhuje, Saurabh; Islam, Abdullah; Zhu, Long; Zhang, Jun; Wang, Zhongxuan; Parker, Thomas; Yu, Jian; Ren, Shenqiang
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Surfactant templated biogenic nanoporous silica thermal insulation composite
errJOURNAL OF MATERIALS CHEMISTRY A
IF9.5
err2024-01-01
err0
errOAAI
errZhu, Long; Meng, Taotao; Khuje, Saurabh; Ren, Shenqiang
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errSave
Electrically-driven textiles using hierarchical aramid fiber
errNANO ENERGY
IF17.1
err2023-12-01
err8
PREAI
errLi, Zheng; Islam, Abdullah; Khuje, Saurabh; Ren, Shenqiang
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errSave
Additive Manufacturing of High-Temperature Hybrid Electronics via Molecular-Decomposed Metals
errADVANCED FUNCTIONAL MATERIALS
IF19
err2023-10-20
err6
errOAAI
errKhuje, Saurabh; Alshatnawi, Firas; Smilgies, Detlef; Alhendi, Mohammed; Islam, Abdullah; Armstrong, Jason; Yu, Jian; Poliks, Mark; Ren, Shenqiang
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errSave
Additive Manufacturing of High-Temperature Preceramic-Derived SiOC Hybrid Functional Ceramics
errADVANCED ENGINEERING MATERIALS
IF3.3
err2023-09-28
err2
errOAAI
errLi, Zheng; Khuje, Saurabh; Islam, Abdullah; Ren, Shenqiang
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errSave
Printing conformal and flexible copper networks for multimodal pressure and flow sensing
errNANOSCALE
IF5.1
err2023-01-01
err3
PREAI
errKhuje, Saurabh; Islam, Abdullah; Yu, Jian; Ren, Shenqiang
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errSave
3D-printed electrically conductive silicon carbide
errADDITIVE MANUFACTURING
IF11.1
err2022-11-01
err10
errOAAI
errGuo, Zipeng; An, Lu; Khuje, Saurabh; Chivate, Aditya; Li, Jiao; Wu, Yiquan; Hu, Yong; Armstrong, Jason; Ren, Shenqiang; Zhou, Chi
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errSave
Conformal Cu-CuNi Thermocouple Using Particle-Free Ink Materials
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2022-10-25
err16
PREAI
errSheng, Aaron; Khuje, Saurabh; Li, Zheng; Yu, Jian; Ren, Shenqiang
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errSave
High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing
errADVANCED ENGINEERING MATERIALS
IF3.3
err2022-10-06
err1
errOAAI
errSheng, Aaron; Khuje, Saurabh; Yu, Jian; Zhuang, Cheng-Gang; Ren, Shenqiang
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errSave
Lithiating magneto-ionics in a rechargeable battery
errPROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA
IF9.1
err2022-06-13
err5
errOAAI
errHu, Yong; Gong, Weiyi; Wei, Sichen; Khuje, Saurabh; Huang, Yulong; Li, Zheng; Li, Yuguang C.; Yao, Fei; Yan, Qimin; Ren, Shenqiang
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errSave
High-Temperature Copper-Graphene Conductors via Aerosol Jetting
errADVANCED ENGINEERING MATERIALS
IF3.3
err2022-04-04
err5
PREAI
errYu, Jian; Khuje, Saurabh; Sheng, Aaron; Kilczewski, Steven; Parker, Thomas; Ren, Shenqiang
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errSave
Molecular copper decomposition ink for printable electronics
errChemical Communications
IF4.2
err2022-01-01
err15
PREAI
errSheng, Aaron; Islam, Abdullah; Khuje, Saurabh; Yu, Jian; Tsang, Harvey; Bujanda, Andres; Ren, Shenqiang
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errSave
Flexible Copper Nanowire Electronics for Wireless Dynamic Pressure Sensing
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2021-11-23
err19
PREAI
errKhuje, Saurabh; Sheng, Aaron; Yu, Jian; Ren, Shenqiang
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errSave
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics
errNANO LETTERS
IF9.1
err2021-10-28
err12
PREAI
errSheng, Aaron; Khuje, Saurabh; Yu, Jian; Petit, Donald; Parker, Thomas; Zhuang, Cheng-Gang; Kester, Lanrik; Ren, Shenqiang
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errSave

Research Directions

No research directions
Co-authors
Cooperation Journals
L
Liangbing Hu
H-index: 188 · Papers: 665
J
Jeffrey C. Grossman
H-index: 88 · Papers: 772
D
Detlef‐M. Smilgies
H-index: 78 · Papers: 416
郑
郑洪河 (Haimei Zheng)
H-index: 76 · Papers: 345
张俊 cover
张俊 (Jun Zhang)
H-index: 72 · Papers: 720
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