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Shou-Yi Chang

national tsing hua university

37H-index
212Paper Count
6.9KCitation Count
Published Papers 104
Publication Date
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Stress rupture-resistant boron-doped Hf-Mo-Nb-Ta-Ti-V-Zr-based refractory high-entropy alloys
errMaterials Science and Engineering A-Structural Materials Properties Microstructure and Processing
IF7
err2026-07-07
err0
PREAI
errPing-Hsu Ko; Cheng-Yuan Tsai; Ya-Jing Lee; Jen-Ho Wang; Shou-Yi Chang
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Small-Scale Insight into Uniform Deformability and Softening Resistance of Refractory High-Entropy Alloy
errNano Letters
IF9.1
err2026-02-19
err0
errOAAI
errCheng-Yuan Tsai; Wen-Ju Chen; Yuan-Tao Hsu; Chi-Huan Tung; Su-Jien Lin; Jien-Wei Yeh; Shou-Yi Chang
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Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion
errNPG Asia Materials
IF8.3
err2025-11-29
err0
errOAAI
errHong-Yi Wu; Yi-Ying Fang; Yu-Lin Chen; Jung-Fu Lu; Ming-Yen Lu; Shou-Yi Chang; Pei Yuin Keng
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Ion-irradiation-induced ultraviolet color centers in polydimethylsiloxane
errJournal of Polymer Research
IF2.8
err2025-10-21
err0
errOAAI
errJie-En Lee; Donyau Chiang; Shou-Yi Chang; Fuqian Yang; Sanboh Lee
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Softening-resistant ultra-strong nanotwinned CoCrFeNi medium entropy alloy thin films
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2025-04-01
err0
PREAI
errWang, Jian-Jie; Tsai, Cheng-Yuan; Chang, Shou-Yi; Tu, King-Ning; Ouyang, Fan-Yi
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The Role of Polycrystalline MoS2 as Diffusion Barrier in Ru Interconnects: Thermal Stability and Electrical Performances
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2025-03-31
err0
PREAI
errJhan, DJ; Hsiao, KY; Sarkar, R; Lu, JW; Chen, YL; Chen, HYT; Keng, PY; Chang, SY; Lu, MY
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Kinetic Analysis of the Cracking Behavior in Methanol-Treated Poly(methyl methacrylate)/Functionalized Graphene Composites
errJOURNAL OF COMPOSITES SCIENCE
IF3.7
err2025-02-11
err0
errOAAI
errYang, Bing-Hong; Chang, Shou-Yi; Zhang, Yulin; Lee, Sanboh
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Microstructural stability enhancement and mechanical reinforcement of TLP-bonded Cu/Sn-3.5Ag/Cu microbumps under multiple reflow cycles through Zn Alloying and Ni substrate integration
errVACUUM
IF3.9
err2025-02-01
err0
PREAI
errLee, Yin-Ku; Chan, Yun-Chen; Wu, Zih-Yu; Tsai, Su-Yueh; Chang, Shou-Yi; Duh, Jenq-Gong
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Boron interstitials strengthening grain boundary for toughening HfxMo0.5NbTaxTiV1.5-xZrx refractory high-entropy alloys
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2025-02-01
err0
PREAI
errKo, Ping-Hsu; Lee, Ya-Jing; Wang, Jen-Ho; Tsai, Cheng-Yuan; Chang, Shou-Yi
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Enhancing the Strength and Ductility Synergy of Lightweight Ti-Rich Medium-Entropy Alloys through Ni Microalloying
errMATERIALS
IF3.2
err2024-06-13
err2
errOAAI
errChen, Po-Sung; Liu, Jun-Rong; Tsai, Pei-Hua; Liao, Yu-Chin; Jang, Jason Shian-Ching; Wu, Hsin-Jay; Chang, Shou-Yi; Chen, Chih-Yen; Tsao, I-Yu
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Creep-recovery deformation of 304 stainless-steel springs under low forces
errMECHANICS OF MATERIALS
IF4.1
err2024-06-01
err0
PREAI
errTsai, Ming-Yen; Chang, Shou-Yi; Zhang, Yulin; Yang, Fuqian; Lee, Sanboh
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RuAl intermetallic compound of low resistivity scaling and high thermal stability as potential interconnect metallization
errAPPLIED PHYSICS LETTERS
IF3.6
err2024-04-05
err4
errOAAI
errFang, Yi-Ying; Tsai, Yung-Hsuan; Chen, Yu-Lin; Jhan, Dun-Jie; Lu, Ming-Yen; Keng, Pei Yuin; Chang, Shou-Yi
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Surface sulfurization of liner and ruthenium metallization to reduce interface scattering for Low-Resistance interconnect
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-04-01
err1
PREAI
errChen, Yu -Lin; Hsiao, Kai-Yuan; Lu, Ming -Yen; Keng, Pei Yuin; Chang, Shou-Yi
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Viscoelastic relaxation and topological fluctuations in glass-forming liquids
errJOURNAL OF CHEMICAL PHYSICS
IF3.1
err2024-03-06
err4
errOAAI
errTung, Chi-Huan; Chang, Shou-Yi; Yip, Sidney; Wang, Yangyang; Carrillo, Jan-Michael Y.; Sumpter, Bobby G.; Shinohara, Yuya; Do, Changwoo; Chen, Wei-Ren
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Functionalizing self-assembled monolayers to reduce interface scattering in ruthenium/dielectric for next-generation microelectronic interconnects
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-02-01
err0
PREAI
errHsu, Bin-Fu; Sun, Jia-You; Chen, Yu-Lin; Lu, Ming-Yen; Chang, Shou-Yi; Keng, Pei Yuin
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Chemical complexity-changed deformation behavior of NiTi-based B2 low- to high-entropy intermetallic compounds: Atomistic simulations
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2023-12-01
err0
PREAI
errTsai, Cheng-Yuan; Tung, Chi-Huan; Chen, Chun-Cheng; Chang, Shou-Yi
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Grain modification and formation of tough IMC phase in submicron Sn-Ag microbumps via doping Zn and Ni in Cu substrate
errVACUUM
IF3.9
err2023-11-01
err1
PREAI
errLee, Yin-Ku; Wu, Zih-You; Huang, Pin-Wei; Chao, Chen-Sung; Tsai, Su-Yueh; Chang, Shou-Yi; Duh, Jenq-Gong
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Thermal Stability and Orthogonal Functionalization of Organophosphonate Self-Assembled Monolayers as Potential Liners for Cu Interconnect
errACS OMEGA
IF4.3
err2023-10-13
err1
errOAAI
errChou, Yu-Wei; Chang, Shou-Yi; Keng, Pei Yuin
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Unleashing the Power of 2D MoS2: In Situ TEM Study of Its Potential as Diffusion Barriers in Ru Interconnects
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2023-10-04
err1
PREAI
errFeng, Ping-Hsuan; Hsiao, Kai-Yuan; Jhan, Dun-Jie; Chen, Yu-Lin; Keng, Pei Yuin; Chang, Shou-Yi; Lu, Ming-Yen
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Grain-boundary/interface structures and scatterings of ruthenium and molybdenum metallization for low-resistance interconnects
errAPPLIED SURFACE SCIENCE
IF6.9
err2023-08-01
err8
PREAI
errChen, Yu -Lin; Fang, Yi-Ying; Lu, Ming-Yen; Keng, Pei Yuin; Chang, Shou-Yi
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Research Directions

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Co-authors
Cooperation Journals
C
Chwee Teck Lim
H-index: 123 · Papers: 763
E
Edwin L. Thomas
H-index: 112 · Papers: 807
B
Brenda W. Gillespie
H-index: 99 · Papers: 501
J
Jien‐Wei Yeh
H-index: 90 · Papers: 278
B
Bobby G. Sumpter
H-index: 86 · Papers: 922
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