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SaveFluorine-Free Thermoplastic High-Frequency Low Dielectric Poly(ether imide)s for Flexible Copper Clad Laminates
Deng, B; Chen, KJ; Bei, RX; Tian, WF; Liang, L; Liu, Q; Li, CY; Huang, HT; Kang, X; Liu, QF; Chen, ZQ; Chi, ZG; Liu, SW; Zhang, Y
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SaveLow-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
Meng, HF; Chen, KJ; Li, CY; He, YW; Huang, ZH; Huang, HT; Chi, ZG; Liu, SW; Zhang, Y
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