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康仁科 (Renke Kang)

Dalian University of Technology

43H-index
286Paper Count
5.9KCitation Count
Published Papers 154
Publication Date
Establishment of strain rate prediction model for ultrasonic elliptical vibration cutting of 92W-5Ni-3Fe
errTungsten
IF11.2
err2025-12-29
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PREAI
errSen Yin; Meng-Hao Liu; Xin-Ran Liu; Fu-Chen Li; Xiao-Qiang Wang; Ren-Ke Kang
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Finishing path planning of Nomex honeycomb core via ultrasonic cutting
err2025-12-11
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PREAI
errHeng Luo; Zhi-Gang Dong; Yan Qin; Ren-Ke Kang; Yi-Dan Wang
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Aspheric mirror high-efficiency precision grinding strategy based on the residual height modeling
err2025-11-13
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PREAI
errDesheng Gao; Xiaoguang Guo; Wanxue Zhang; Yu Pu; Zhiqiang Liu; Renke Kang; Zhigang Dong
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Effects of Laser Energy Uniformization via Static Beam Shaping on Ablation Behavior and Mechanism of SiCf/SiC Composites
err2025-11-11
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PREAI
errXintong Cai; Xin Qin; Jinbo Niu; Renke Kang; Zhigang Dong; Yan Bao; Guangyi Ma; Fangyong Niu
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Study on fretting wear and fatigue fracture of cast nickel-based superalloy K417G dovetail specimen
err2025-10-26
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PREAI
errPingzhong Zhu; Yiming Zhang; Zhigang Dong; Nianwei Xu; Renke Kang; Kun Shan; Yan Bao
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Simulation modeling of wafer grinding topography considering spindle inclination angle
err2025-08-05
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PREAI
errTianyu Li; Xianglong Zhu; Renke Kang; Meng Li; Jiahui Xu; Lihao Dai
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Material Removal Mechanism for Photoelectrochemical Mechanical Polishing of GaN Wafers with Different Oxidation Degrees
err2025-07-25
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errOAAI
errYuewen Sun; Renke Kang; Han Huang; Yang Zhao; Shang Gao; Zhigang Dong
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Effects of laser and ultrasonic combined action on material removal of Cf/SiC composites during single grain scratching
err2025-07-24
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PREAI
errZhigang Dong; Kang Ding; Xintong Cai; Qihao Zhang; Yan Bao; Renke Kang; Fangyong Niu
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