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SaveReliability Analysis of Solder Joints in Aerospace Electronics: Failure Mechanism, Modeling and Evaluation
Ma, Zhen; Diwu, Dongchao; Wang, Kai; Mu, Jinyang; An, Xiao; Wang, Hu; Guo, Gaolong; Hu, Yingxi; Ren, Junfei; Fan, Linxi
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SaveSchiff-base crosslinked gelatin-mycosporine-like amino acids/dialdehyde starch composite film: a UV-resistant, biodegradable food packaging material
Wang, Donghui; Li, Ke; Zhang, Jingyun; Zhou, Kaiqing; Wang, Kai; Wang, Yingzi; Yang, Shuo; Wang, Shuxin; Wang, Pu; Chen, Hao
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