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H

Hak‐Sung Kim

hanyang university

59H-index
452Paper Count
1.2WCitation Count
Published Papers 156
Publication Date
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Anisotropic viscoelastic properties of prepreg and their influence on warpage of thin PCB substrates
errComposites Part A-Applied Science and Manufacturing
IF8.9
err2026-07-31
err0
PREAI
errSanjay Kumar; Woong-Kyoo Yoo; Jaesung Kim; Chae-Young Ahn; Jinwoong Kim; Chan Hyuk Park; Hak-Sung Kim
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Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packaging
errMaterials Today Advances
IF8
err2026-04-21
err0
errOAAI
errJeong-Hyeon Baek; Woong-Kyoo Yoo; Woo-Jin An; Jun-Seop Song; Gyung-Hwan Oh; Ji-Hye Shim; Hak-Sung Kim
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Dry plasma-enhanced adhesion of Ti/Cu seed layers to ABF substrates for fine-pitch packaging reliability
errApplied Surface Science
IF6.9
err2026-04-19
err0
PREAI
errSe-Min Lee; Hui-Jin Um; Na-Hyun Jeon; Hyun-Ji Rho; Soon-Oh Jeong; Young-Ju Han; Moo-Seong Kim; Hak-Sung Kim
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Non-destructive evaluation of thermally induced structural transformation in PET using terahertz time-domain spectroscopy
errMaterials Today Advances
IF8
err2026-02-25
err0
errOAAI
errTae-Wan Kim; Sang-Il Kim; Heon-Su Kim; Chang-Jin Moon; Hak-Sung Kim
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Rapid PCB warpage modeling through automated copper pattern classification and classical lamination Theory–Driven anisotropic viscoelastic homogenization
errcomposites part a: applied science and manufacturing
IF0
err2026-02-22
err0
PREAI
errWoong-Kyoo Yoo; Jeong-Hyeon Baek; Jong-Whi Park; Sanjay Kumar; Hak-Sung Kim
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In-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic waves
errMeasurement
IF5.6
err2025-12-11
err0
PREAI
errSang-Il Kim; Heon-Su Kim; Tae-Wan Kim; Jinsang Lim; Dong-Su Han; Hae Gu Lee; Hak-Sung Kim
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Microstructured Anisotropic PDMS Sheet for Damage-free Electrical Testing of Semiconductor Packages
errSensors and Actuators A: Physical
IF0
err2025-12-11
err0
PREAI
errYulim Seol; Jaeheon Jeong; Ji-Hye Shim; Hak-Sung Kim; Hongyun So
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A critical review of the past, present, and future of 3D printing for continuous and short fiber composites
errComposite Structures
IF7.1
err2025-11-07
err0
PREAI
errSanjay Kumar; Dong-Hoon Yoo; Jun-Seop Song; Hak-Sung Kim
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Optimization and field evaluation of a detachable thermal insulation fabric for rail temperature mitigation
errConstruction and Building Materials
IF8
err2025-10-27
err0
PREAI
errJuyeop Park; Donghoon Kang; Hak-Sung Kim
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Integrated design and validation of 3D radiant heater for electric vehicles: Thermo-Electrical finite element analysis considering strain-dependent resistance in thermo-forming
errMaterials & Design
IF7.9
err2025-09-05
err0
errOAAI
errJeong-Hyeon Baek; Tae-In Park; Yoon-Jin Kim; Ji-Sun Park; Hak-Sung Kim
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Synergistic role of Bi, Ni, and Pd alloying in SAC305 for enhanced IMC suppression and superior thermo-mechanical performance
errJournal of Materials Research and Technology
IF6.6
err2025-08-25
err0
errOAAI
errYou-Gwon Kim; Heon-Su Kim; Tae-Wan Kim; Hyeong-Bin Park; Jong-Whi Park; Yongrae Jang; Bongtae Han; Jun-Hyeong Lee; Jin Gyu Kim; Hak-Sung Kim
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In-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopy
errNDT & E International
IF4.5
err2025-08-20
err0
PREAI
errSang-Il Kim; Hak-Sung Kim
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Repeated impact behavior of multifunctional carbon fiber reinforced plastic composites sandwich structures with 3D printed novel rail interlocking core
errcomposites part a applied science and manufacturing
IF0
err2025-08-11
err0
PREAI
errHyun-Ji Rho; Hui-Jin Um; Ji-Hwan Shin; Hak-Sung Kim
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Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste
errNano Convergence
IF11
err2025-07-23
err0
errOAAI
errYoung-Min Ju; Tae-Wan Kim; Seung-Hyun Lee; Ho-Jin Lee; Jinho Ahn; Hak-Sung Kim
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Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging
errAdvanced Materials Technologies
IF6.2
err2025-06-25
err0
errOAAI
errKeuntae Baek; Minhyeok Kim; Hak-Sung Kim; Jinho Ahn; Hongyun So
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Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation test
errApplied Surface Science Advances
IF8.7
err2025-06-07
err0
PREAI
errYoung-Min Ju; Dukyong Kim; Se-Min Lee; Heuisu Kim; Daewoong Lee; Yeon-Taek Hwang; Seung Hwan Lee; Hak-Sung Kim
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Microstructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structures
errMATERIALS & DESIGN
IF7.9
err2025-04-01
err0
errOAAI
errPark, Sangyeun; Chun, Byungkwon; Kim, Sunbum; Kim, Hak-Sung
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Enhancing cold storage efficiency: Continuous deep deterministic policy gradient approach to energy optimization utilizing strategic sensor input data
errENERGY CONVERSION AND MANAGEMENT-X
IF7.6
err2025-04-01
err0
errOAAI
errPark, Jong-Whi; Ju, Young-Min; Kim, Hak-Sung
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Spatial coherency analysis of seismic motions from a hard rock site dense array in Busan, Korea
errBULLETIN OF EARTHQUAKE ENGINEERING
IF4.1
err2024-10-29
err1
PREAI
errLee, Yonghee; Lee, Dongyeon; Kim, Hak-Sung; Park, Jeong-Seon; Jung, Dong-Yeoul; Kim, Jungkyun; Kim, Do Yeon; Lee, Yongsun; Park, Duhee
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Intense pulsed light-induced millisecond selective heat treatment for high-performance silicon anodes
errCHEMICAL ENGINEERING JOURNAL
IF13.2
err2024-10-01
err0
PREAI
errPark, Changyong; Kim, Sucheol; Lee, Hojae; Park, Jong-Whi; Choi, Minwoo; Do, Kwanghyun; Song, Chiho; Kim, Hak-Sung; Kim, Young-Beom; Rhee, Junki; Bansal, Neetu; Salunkhe, Rahul R.; Ahn, Heejoon
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Research Directions

No research directions
Co-authors
Cooperation Journals
T
Taeghwan Hyeon
H-index: 169 · Papers: 688
K
K. N. Houk
H-index: 157 · Papers: 2.6K
K
Kimoon Kim
H-index: 106 · Papers: 708
J
Jinwoo Lee
H-index: 97 · Papers: 507
J
Jae Wook Lee
H-index: 93 · Papers: 2.3K
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