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M
Myung Jun Kim
Sungkyunkwan University
29
H-index
158
Paper Count
3.7K
Citation Count
0
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Published Papers
85
Publication Date
Publication Date
Impact Factor
Citations
Single-additive TSV filling achieved with a tris-ammonium-based suppressor
Materials & Design
IF
7.9
2026-01-24
0
OA
AI
Haejin Kwak; Youngran Seo; Hui Won Eom; Thomas P. Moffat; Dongwon Yoo; Myung Jun Kim
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Additive-directed electrodeposition of Ag nanoplates for electrochemical H2O2 detection
Surfaces and Interfaces
IF
6.3
2025-12-06
0
PRE
AI
Seolim Yoon; Yujin Min; Myung Jun Kim
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Cysteine–halide ion synergy for suppressing side reactions on Zn anodes in AZIBs
Electrochimica Acta
IF
5.6
2025-11-20
0
PRE
AI
Jiwoo Oh; Hana Lim; Myung Jun Kim
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Machine learning for voltammetric analysis of cu electroplating additives: electrochemically-guided design for dataset structure
Journal of Electroanalytical Chemistry
IF
4.1
2025-10-13
0
PRE
AI
Wonyeong Jo; Young Yoon; Myung Jun Kim
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Water-attracting adsorbates for enhancing the cyclability of Zn anodes in aqueous Zn-ion batteries
J. Mater. Chem. A
IF
9.5
2025-08-12
0
PRE
AI
Hana Lim; Dongju Kim; Jiwoo Oh; Eunseo Yoo; Junyoung Mun; Minho Kim; Myung Jun Kim
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Formation of twin structures via Cu electrodeposition with SPS and Cl-
materials science materials in engineering
IF
0
2025-07-23
0
PRE
AI
Jeongho Lee; Yoojin Hwang; Myung Jun Kim
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Pretreatments for photoresist-patterned wafer to improve Cu pillar electrodeposition
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
IF
6
2025-05-01
0
PRE
AI
Park, Soo Woong; Kim, Myung Jun; Kim, Jae Jeong
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Quantitative analyses of DPS and PEG-PPG in Cu electrolyte using machine learning with artificial neural network
ELECTROCHIMICA ACTA
IF
5.6
2025-02-01
0
PRE
AI
Kim, Jeong Wuk; Seo, Huiju; Kim, Myung Jun; Kim, Jae Jeong
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Synergistic effect of CTA plus and Br- on defect-free TSV filling by Cu electrodeposition
ELECTROCHIMICA ACTA
IF
5.6
2024-11-01
0
PRE
AI
Eom, Hui Won; Kwak, Haejin; Yang, Chung-Mo; Lee, Woon Young; Lee, Min Hyung; Kim, Myung Jun
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Enhancing Proton Exchange Membrane Water Electrolysis with a Checkered Carbon Matrix Containing Ir-Ru Nanoparticles
ADVANCED ENERGY MATERIALS
IF
26
2024-08-29
0
OA
AI
Huynh, T. B. Ngoc; Song, Jihyeok; Bae, Hyo Eun; Sung, Yung-Eun; Kim, Myung Jun; Kwon, Oh Joong
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Cu microvia filling by pulse-reverse electrodeposition with a single accelerator
ELECTROCHIMICA ACTA
IF
5.6
2024-06-01
2
PRE
AI
Seo, Huiju; Kim, Jounghee; Kang, Jungkyu; Park, Jong-Eun; Kim, Myung Jun; Kim, Jae Jeong
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Therapeutic strategy using novel RET/YES1 dual-target inhibitor in lung cancer
BIOMEDICINE & PHARMACOTHERAPY
IF
7.5
2024-02-01
0
OA
AI
Choi, Yong June; Choi, Munkyung; Park, Jaewoo; Park, Miso; Kim, Myung Jun; Lee, Jae-sun; Oh, Su-jin; Lee, Young Joo; Shim, Wan Seob; Kim, Ji Won; Kim, Myung Jin; Kim, Yong-Chul; Kang, Keon Wook
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Enhancement of heat dissipation in β-Ga2O3 Schottky diodes through Cu-filled thermal vias: experimental and simulation investigations
JOURNAL OF MATERIALS CHEMISTRY C
IF
5.1
2024-01-01
0
PRE
AI
You, Younghyun; Eom, Hui Won; Park, Jehwan; Kim, Myung Jun; Kim, Jihyun
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Behavior of a forest of NiFe nanowires in KOH and NaCl solution for water electrolysis
ELECTROCHIMICA ACTA
IF
5.6
2023-11-01
4
OA
AI
Carbone, S.; Proietto, F.; Bonafede, F.; Oliveri, R. L.; Patella, B.; Ganci, F.; Aiello, G.; Mandin, P.; Kim, M.; Scopelliti, M.; Inguanta, R.
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Heat Treatment for Enhancing Ir-Based Catalysts Enclosed in a Carbon Layer for Electrochemical Oxygen Evolution Reaction
ACS SUSTAINABLE CHEMISTRY & ENGINEERING
IF
7.3
2023-10-04
4
PRE
AI
Huynh, T. B. Ngoc; Choi, Yeongeun; Lee, Min Hyung; Oh, Sekwon; Kim, Myung Jun; Kwon, Oh Joong
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A cracked carbon matrix decorated with amorphous IrOx for boosting the oxygen evolution reaction in electrochemical water splitting
JOURNAL OF MATERIALS CHEMISTRY A
IF
9.5
2023-01-01
11
PRE
AI
Huynh, T. B. Ngoc; Lee, Dohyeon; Kim, Soo-Kil; Kim, Myung Jun; Kwon, Oh Joong
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Shape Control of Metal Nanostructures by Electrodeposition and their Applications in Electrocatalysis
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF
3.3
2022-11-17
7
PRE
AI
Yeo, Kyeong-Rim; Eo, Jooyoung; Kim, Myung Jun; Kim, Soo-Kil
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Electrodeposition of Nano-Twinned Cu and their Applications in Electronics
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF
3.3
2022-11-04
11
PRE
AI
Park, Soo Woong; Eom, Hui Won; Kim, Myung Jun; Kim, Jae Jeong
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Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition
ELECTROCHIMICA ACTA
IF
5.6
2022-07-01
15
PRE
AI
Lee, Myung Hyun; Lee, Yoonjae; Kim, Jung Ah; Jeon, Youngkeun; Kim, Myung Jun; Kim, Young Gyu; Kim, Jae Jeong
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Modulating the active sites of nickel phosphorous by pulse-reverse electrodeposition for improving electrochemical water splitting
APPLIED CATALYSIS B-ENVIRONMENT AND ENERGY
IF
21.1
2022-07-01
60
PRE
AI
Kim, Byung Keun; Kim, Myung Jun; Kim, Jae Jeong
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Research Directions
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Co-authors
Cooperation Journals
Y
Yung‐Eun Sung
H-index: 100 · Papers: 753
S
Soo Young Kim
H-index: 86 · Papers: 623
B
Benjamin J. Wiley
H-index: 78 · Papers: 219
K
Ken Gall
H-index: 78 · Papers: 445
M
Myeong‐Jin Kim
H-index: 73 · Papers: 914
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