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S

Subramanian S. Iyer

University of California System

44H-index
351Paper Count
7.3KCitation Count
Published Papers 13
Publication Date
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Secure artificial intelligence at the edge
errPHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES
IF3.7
err2025-01-16
err0
PREAI
errSehatbakhsh, Nader; Pamarti, Sudhakar; Roychowdhary, Vwani; Iyer, Subramanian
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3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices
err2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
IF0
err2023-05-01
err1
PREAI
errOuyang, Guangqi; Fukushima, Takafumi; Ren, Haoxiang; Iyer, Subramanian S.
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Fabrication of Flexible Li-ion Battery Electrodes Using Battlets Approach with Ionic Liquid Electrolyte for Powering Wearable Devices
errieee
IF0
err2022-05-01
err1
PREAI
errOuyang, Guangqi; Whang, Grace; MacInnis, Emily; Ren, Haoxiang; Sun, Henry; Irwin, Randall; Dunn, Bruce; Iyer, Subramanian S.
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A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils
errieee
IF0
err2021-06-01
err4
PREAI
errOuyang, Guangqi; Ezhilarasu, Goutham; Sun, Henry; Ren, Haoxiang; Yang, Yu-Tao; Iyer, Subramanian S.
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errSave
Fabrication of Flexible Ionic-Liquid Thin Film Battery Matrix on FlexTrate™ for Powering Wearable Devices
errieee
IF0
err2021-06-01
err4
PREAI
errOuyang, Guangqi; Whang, Grace; MacInnis, Emily; Iyer, Subramanian S.
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Nb-based superconducting silicon interconnect fabric for cryogenic electronics
errQUANTUM SCIENCE AND TECHNOLOGY
IF5
err2021-02-24
err7
PREAI
errYang, Yu-Tao; Hu, Chaowei; Zhang, Peng; Shakoorzadeh, Niloofar; Ni, Ni; Wang, Kang L.; Iyer, Subramanian S.
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Heterogenous Integration of MEMS Gas Sensor using FOWLP : Personal Environment Monitors
err2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)
IF0
err2020-06-01
err1
PREAI
errBenedict, Samatha; Nagarajan, Ashvin; Thejas, K.; Alam, Arsalan; Illango, Murugaiya Sridar; Ezhilarasu, Goutham; Prajapati, Chandra Shekhar; Bhat, Navakanta; Iyer, Subramanian
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Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias
errIEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
IF3.8
err2016-09-01
err18
PREAI
errKirihata, Toshiaki; Golz, John; Wordeman, Matthew; Batra, Pooja; Maier, Gary W.; Robson, Norman; Graves-abe, Troy L.; Berger, Daniel; Iyer, Subramanian S.
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Three-dimensional integration: An industry perspective
errMRS BULLETIN
IF4.9
err2015-03-10
err55
PREAI
errIyer, Subramanian S.
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errSave
Technical Perspective Silicon Stress
errCOMMUNICATIONS OF THE ACM
IF12.2
err2014-01-01
err0
PREAI
errIyer, Subramanian S.
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Nonlinear damping for vibration isolation of microsystems using shear thickening fluid
errAPPLIED PHYSICS LETTERS
IF3.6
err2013-06-24
err38
PREAI
errIyer, S. S.; Vedad-Ghavami, R.; Lee, H.; Liger, M.; Kavehpour, H. P.; Candler, R. N.
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3D integration review
errSCIENCE CHINA-INFORMATION SCIENCES
IF7.6
err2011-05-05
err39
PREAI
errFarooq, Mukta G.; Iyer, Subramanian S.
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Band-edge photoluminescence from pseudomorphic Si0.96Sn0.04 alloy
errAPPLIED PHYSICS LETTERS
IF3.6
err1996-05-27
err17
PREAI
errKhan, AST; Berger, PR; Guarin, FJ; Iyer, SS
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Research Directions

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Co-authors
Cooperation Journals
B
Bruce Dunn
H-index: 103 · Papers: 656
K
Kang L. Wang
H-index: 75 · Papers: 712
N
Ni Ni
H-index: 68 · Papers: 484
V
Vwani Roychowdhury
H-index: 49 · Papers: 328
Y
Yu-Tao Yang
H-index: 32 · Papers: 119
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