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K

K. N. Tu

zhejiang tongtu traffic engineering co., ltd., hangzhou 310051, china

61H-index
206Paper Count
1.6WCitation Count
Published Papers 46
Publication Date
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Synergistic Microstructures, Mechanical Properties, and Piezoresistive Performance Improvement of Nanoengineered Cementitious Composites by CNT and GNP
errBuildings 2025, Vol. 15, Page 4104
IF3.1
err2025-11-18
err0
errOAAI
errKebiao Tu; Yeqing Zhang; Junjian Wang; Haiyan Yang; Jin Tao; Qiang Zeng
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Large-scale multimodal model based embodied intelligent robots: A survey
errEngineering Applications of Artificial Intelligence
IF8
err2025-11-12
err0
PREAI
errKairong Tu; Xiaoguang Ma; Zhenxing Qian; Puhong Duan
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Electromigration failure induced by interdiffusion between Al trace and Cu seed layer in the immortal microbump in three-dimensional integrated circuit
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-05-01
err0
errOAAI
errYao, Yifan; An, Yuxuan; Tu, K. N.
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Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-04-01
err0
PREAI
errLu, Wan-Hsin; Tran, Dinh-Phuc; Lin, Huai-En; Shen, Guan-You; Chen, Bo-Yan; Lee, Kang-Ping; Tsai, Chih-Chi; Lin, Yi-Quan; Tu, K. N.; Chen, Chih
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To suppress tin whisker growth by using (100)-oriented copper
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-03-01
err0
errOAAI
errLin, Han-Wen; Lu, Jia-Ling; Hu, Chih-Chia; Tu, K. N.; Chen, Chih
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Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
errSCRIPTA MATERIALIA
IF5.6
err2024-09-01
err2
PREAI
errYao, Yifan; Gusak, A. M.; Chen, Chih; Liu, Yingxia; Tu, K. N.
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Effect of Joule heating on the reliability of microbumps in 3D IC
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-07-01
err6
errOAAI
errYao, Yifan; An, Yuxuan; Dong, Jiatong; Wang, Yang; Tu, K. N.; Liu, Yingxia
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Observer-based resilient dissipativity control for discrete-time memristor-based neural networks with unbounded or bounded time-varying delays
errNEURAL NETWORKS
IF6.3
err2024-07-01
err12
PREAI
errTu, Kairong; Xue, Yu; Zhang, Xian
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A new approach based on system solutions for passivity analysis of discrete-time memristor-based neural networks with time-varying delays
errAPPLIED MATHEMATICS AND COMPUTATION
IF3.4
err2024-05-01
err3
PREAI
errTu, Kairong; Xue, Yu; Zhang, Xian
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Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility
errELECTROCHIMICA ACTA
IF5.6
err2021-09-01
err24
PREAI
errDinh-Phuc Tran; Chen, Kuan-Ju; Tu, K. N.; Chen, Chih; Chen, Yao-Tsung; Chung, Stream
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A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2021-09-01
err22
errOAAI
errJuang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Hsu, Po-Ning; Tsou, Nien-Ti; Tu, K. N.; Chen, Chih
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Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2021-02-01
err35
PREAI
errChang, Shih-Yang; Chu, Yi-Cheng; Tu, K. N.; Chen, Chih
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errSave
Deformation induced columnar grain rotation in nanotwinned metals
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2020-10-01
err14
PREAI
errLi, Yu-Jin; Hsu, Chia-Wei; Ting, Yi-Hsin; Tsou, Nien-Ti; Lo, Yu-Chieh; Wu, Wen-Wei; Tu, K. N.; Chen, Chih
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Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology
errMATERIALS SCIENCE & ENGINEERING R-REPORTS
IF26.8
err2019-04-01
err143
PREAI
errTu, K. N.; Liu, Yingxia
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Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
errSCIENTIFIC REPORTS
IF3.9
err2018-09-17
err85
errOAAI
errJuang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.
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errSave
Effect of Joule heating and current crowding on electromigration in mobile technology
errAPPLIED PHYSICS REVIEWS
IF11.6
err2017-01-20
err134
PREAI
errTu, K. N.; Liu, Yingxia; Li, Menglu
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Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter
errACTA MATERIALIA
IF9.3
err2016-09-01
err111
PREAI
errLiu, Yingxia; Chu, Ying-Ching; Tu, K. N.
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Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on ⟨1 1 1⟩ oriented and nanotwinned Cu
errACTA MATERIALIA
IF9.3
err2013-08-01
err51
PREAI
errLin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N.
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Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products
errSCIENCE CHINA-TECHNOLOGICAL SCIENCES
IF4.9
err2013-05-21
err44
PREAI
errTu, K. N.; Tian Tian
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Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
errINTERMETALLICS
IF4.8
err2012-10-01
err64
PREAI
errGuo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N.
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Research Directions

No research directions
Co-authors
Cooperation Journals
B
Bruce Dunn
H-index: 103 · Papers: 656
S
Subodh G. Mhaisalkar
H-index: 103 · Papers: 626
K
Kazunori Sato
H-index: 54 · Papers: 312
C
C. R. Kao
H-index: 51 · Papers: 321
Q
Qiang Zeng
H-index: 50 · Papers: 221
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