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Katsuaki Suganuma

University of Osaka

73H-index
906Paper Count
2.3WCitation Count
Published Papers 180
Publication Date
Post-molding interfacial design of sintered silver and copper joints for enhanced fracture resistance and polymer adhesion: Experimental and numerical investigations
err2026-06-29
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errByeongchan Kim; YehRi Kim; Jeong-Min Lee; DongEung Kim; Sangmin Lee; Ming-chun Hsieh; Byeong Kwon Ju; Chuantong Chen; Katsuaki Suganuma; Dongjin Kim
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Study on interfacial mechanism of Ag–Si immiscible sintering for robust migration inhibition
err2026-05-07
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errYang Liu; Chuantong Chen; Ran Liu; Minoru Ueshima; Hiroshi Nishikawa; Masahiko Nishijima; Koji S. Nakayama; Katsuaki Suganuma
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Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission
err2026-02-01
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PREAI
errLee, Sangmin; Chen, Chuantong; Nishijima, Masahiko; Katsura, Akihiro; Nakagiri, Takuya; Kim, Juno; Lee, Jung Shin; Rhee, Minwoo Daniel; Suganuma, Katsuaki
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Mechanism of void growth in electroless copper plating layer of microvias in high-density interconnect packaging substrates
err2025-12-04
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PREAI
errHsieh, Ming-chun; Zhang, Zheng; Nishijima, Masahiko; Okumura, Rieko; Seto, Hiroki; Nishikawa, Hiroshi; Suganuma, Katsuaki
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Symmetry breaking of paracrystalline topology in amorphous silicon
err2025-08-27
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errKoji S. Nakayama; Masahiko Nishijima; Yicheng Zhang; Koji Inoue; Chuantong Chen; Minoru Ueshima; Katsuaki Suganuma
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Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging
err2025-08-21
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errChuantong Chen; Luobin Zhang; Fupeng Huo; Minoru Ueshima; Yutai Su; Xu Long; Koji S Nakayama; Masahiko Nishijima; Hiroaki Miyake; Mingyu Li; Katsuaki Suganuma
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Lead whisker growth characteristics on satellites in Earth orbit
err2025-06-21
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PREAI
errShinichiro Ichimaru; Tsuyoshi Nakagawa; Norio Nemoto; Katsuaki Suganuma; Hiroaki Tatsumi; Hiroshi Nishikawa
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Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability
err2025-01-01
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errChen, Chuantong; Liu, Li; Huo, Fupeng; Kim, Dongjin; Lee, Sangmin; Li, Wanli; Suganuma, Katsuaki
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Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
err2024-12-01
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errZhang, Zheng; Hsieh, Ming-Chun; Nishijima, Masahiko; Suetake, Aiji; Yoshida, Hiroshi; Okumuara, Rieko; Chen, Chuantong; Seto, Hiroki; Hashizume, Kei; Kitahara, Yuhei; Nagamura, Haruki; Suganuma, Katsuaki
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Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding
err2024-11-01
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PREAI
errLee, Sangmin; Baek, Seungyeop; Lee, Seung-Joon; Chen, Chuantong; Nishijima, Masahiko; Suganuma, Katsuaki; Utsunomiya, Hiroshi; Ma, Ninshu; Yu, Ha-Young; Kim, Dongjin
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Microstructure characteristics for improved thermal shock reliability of sintered Ag-Al - Al paste in SiC power module
err2024-11-01
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errHuo, Fupeng; Chen, Chuantong; Zhang, Zheng; Suetake, Aiji; Zhang, Yicheng; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki
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Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition
err2024-10-01
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errLi, Wangyun; Chen, Chuantong; Nishijima, Masahiko; Ueshima, Minoru; Nishikawa, Hiroshi; Suganuma, Katsuaki
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Metastable phases of Ag-Si: amorphous Si and Ag-nodule mediated bonding
err2024-09-03
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errNakayama, Koji S.; Nishijima, Masahiko; Zhang, Yicheng; Chen, Chuantong; Ueshima, Minoru; Suganuma, Katsuaki
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Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability
err2024-09-01
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errChen, Chuantong; Suetake, Aiji; Huo, Fupeng; Kim, Dongjin; Zhang, Zheng; Hsieh, Ming-Chun; Li, Wanli; Wakasugi, Naoki; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki
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Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion
err2024-08-01
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errXu, Yuxin; Qiu, Xiaoming; Wang, Suyu; Huo, Fupeng; Su, Yutai; Xu, Long; Ma, Ninshu; Chen, Chuantong; Suganuma, Katsuaki
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Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
err2024-07-01
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errLiu, Yang; Chen, Chuantong; Wang, Ye; Zhang, Zheng; Liu, Ran; Ueshima, Minoru; Ota, Ichiro; Nishikawa, Hiroshi; Nishijima, Masahiko; Nakayama, Koji S.; Suganuma, Katsuaki
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Effects of high temperature and high humidity on the reliability of copper/ epoxy bond
err2024-07-01
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PREAI
errZhao, Shuaijie; Chen, Chuantong; Nishijima, Masahiko; Okumura, Rieko; Haga, Motoharu; Ueshima, Minoru; Suzuki, Hirose; Takenaka, Hiroto; Suganuma, Katsuaki
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Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
err2024-07-01
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errHuo, Fupeng; Chen, Chuantong; Zhang, Zheng; Zhang, Yicheng; Suetake, Aiji; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Zhang, Keke; Suganuma, Katsuaki
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Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
err2024-04-01
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errHuo, Fupeng; Chen, Chuantong; Zhang, Zheng; Wang, Ye; Suetake, Aiji; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki
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