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Zhang, Zheng; Hsieh, Ming-Chun; Nishijima, Masahiko; Suetake, Aiji; Yoshida, Hiroshi; Okumuara, Rieko; Chen, Chuantong; Seto, Hiroki; Hashizume, Kei; Kitahara, Yuhei; Nagamura, Haruki; Suganuma, Katsuaki Share Save Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot weldingLee, Sangmin; Baek, Seungyeop; Lee, Seung-Joon; Chen, Chuantong; Nishijima, Masahiko; Suganuma, Katsuaki; Utsunomiya, Hiroshi; Ma, Ninshu; Yu, Ha-Young; Kim, Dongjin Share Save Share Save Share Save Share Save Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling ReliabilityChen, Chuantong; Suetake, Aiji; Huo, Fupeng; Kim, Dongjin; Zhang, Zheng; Hsieh, Ming-Chun; Li, Wanli; Wakasugi, Naoki; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki Share Save Share Save Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulationLiu, Yang; Chen, Chuantong; Wang, Ye; Zhang, Zheng; Liu, Ran; Ueshima, Minoru; Ota, Ichiro; Nishikawa, Hiroshi; Nishijima, Masahiko; Nakayama, Koji S.; Suganuma, Katsuaki Share Save 
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