Ge Aerospace, Niskayuna, Ny, Usa

学者数4

论文数1

被引数0

关联论文 (1)

发表时间

Multichip SiC Power Module Packaging Using Direct Ink Writing 使用直接墨水书写技术的多芯片SiC功率模块封装

IEEE Open Journal of Power Electronics

IF3.9

2025-01-01

OAAI

Riadh Al-Haidari; Dylan Richmond; Mohammed Alhendi; El Mehdi Abbara; Abdullah Obeidat; Firas Alshatnawi; Mark Schadt; Mark Poliks; Arun V. Gowda; Jeff Erlbaum; Han Xiong; Collin Hitchcock