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收藏Interface Engineering Suppresses Self-Annealing in Electroplated Nanograined Copper for Low-Temperature Copper-to-Copper Bonding界面工程抑制了电镀纳米铜的自退火,以实现低温铜与铜的键合
Peng, Gangqiang; Dong, Xinyi; Li, Binzhao; He, Chuan; Chen, Cong; Huang, Licheng; Liu, Jian; Zhou, Yonghan; Li, Qikai; Gong, Hao; Wang, Yuechen; Mu, Kaiyu; Cherng, Sheng-Jye; Yang, Po-Yen; Lu, Yang; Yang, Yong; Hung, Shih-Wei; Feng, Shien-Ping
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收藏Area-Selective Etching of Poly(methyl methacrylate) Films by Catalytic Decomposition通过催化分解对聚甲基丙烯酸甲酯薄膜进行区域选择性蚀刻
Lasonen, Valtteri; Vihervaara, Anton; Popov, Georgi; Tois, Eva; Mester, Lars; Karimi, Mohammad; Ilarionova, Yoana; Jam, Reza Jafari; Sundqvist, Jonas; Ritala, Mikko
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收藏Theory and Original Design of Resistive-Inductive Network High-Pass Negative Group Delay Integrated Circuit in 130-nm CMOS Technology
Guerin, Mathieu; Rahajandraibe, Wenceslas; Fontgalland, Glauco; Silva, Hugerles S.; Chan, George; Wan, Fayu; Thakur, Preeti; Thakur, Atul; Frnda, Jaroslav; Ravelo, Blaise
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