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P
Partha Pratim Pande
washington state university
40
H指数
310
论文数
7.0K
被引数
0
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38
发表时间
发表时间
IF
被引数
Special Issue on Emerging Challenges With 3-D NAND Flash Storage
3-D NAND闪存存储的新兴挑战专题
IEEE Design & Test
IF
1.9
2026-02-01
0
PRE
AI
Pande, Partha Pratim
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MFIT : Multi-FIdelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures
ACM Transactions on Design Automation of Electronic Systems
IF
2
2026-01-01
4
PRE
AI
Pfromm, Lukas; Kanani, Alish; Sharma, Harsh; Solanki, Parth; Tervo, Eric; Park, Jaehyun; Doppa, Janardhan; Pande, Partha Pratim; Ogras, Umit
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Special Issue on 20 Years of IEEE CEDA
《IEEE CEDA 20周年》专题
IEEE DESIGN & TEST
IF
1.9
2025-12-01
0
PRE
AI
Pande, Partha Pratim
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HeMu: Energy-Efficient DNN Inferencing via Heterogeneous Multichiplet Architectures
HeMu:通过异构多芯片架构实现高效能深度神经网络推理
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IF
2.9
2025-10-15
0
PRE
AI
Harsh Sharma; Alish Kanani; Janardhan Rao Doppa; Umit Y. Ogras; Partha Pratim Pande
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Special Issue on TinyML
《TinyML专题》
IEEE DESIGN & TEST
IF
1.9
2025-10-01
0
PRE
AI
Pande, Partha Pratim
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Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures Enabled by Non-Bendable Glass Interposer
基于不可弯曲玻璃中介层设计高性能且热可行的高性能多芯粒架构
ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS
IF
2.6
2025-09-01
0
OA
AI
Sharma, Harsh; Doppa, Jana; Ogras, Umit; Pande, Partha
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GINA: Exploiting Graph Neural Network Layer Features for Energy Efficient Inferencing in NVM-based PIM Accelerators
GINA:利用图神经网络层特征实现基于NVM的PIM加速器的能效推理
ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS
IF
2.6
2025-09-01
0
OA
AI
Narang, Gaurav; Ogbogu, Chukwufumnanya; Joardar, Biresh Kumar; Doppa, Janardhan Rao; Chakrabarty, Krishnendu; Pande, Partha Pratim
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THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures
THERMOS: 基于热感知的多目标调度方法,用于异构多裸片PIM架构上的AI工作负载
ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS
IF
2.6
2025-09-01
0
OA
AI
Kanani, Alish; Pfromm, Lukas; Sharma, Harsh; Doppa, Jana; Pande, Partha; Ogras, Umit
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Look-Up Table-Based Energy-Efficient Architecture for Neural Accelerators (LANA)
基于查找表的高效神经网络加速器架构 (LANA)
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IF
2.9
2025-08-06
0
PRE
AI
Ovishake Sen; Chukwufumnanya Ogbogu; Peyman Dehghanzadeh; Janardhan Rao Doppa; Swarup Bhunia; Partha Pratim Pande; Baibhab Chatterjee
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Atleus: Accelerating Transformers on the Edge Enabled by 3D Heterogeneous Manycore Architectures
Atleus:基于3D异构多核架构加速边缘端Transformer
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IF
2.9
2025-01-01
0
PRE
AI
Pratyush Dhingra; Janardhan Rao Doppa; Partha Pratim Pande
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Guest Editorial Chip and Package-Scale Communication-Aware Architectures for General-Purpose, Domain-Specific, and Quantum Computing Systems
用于通用,特定领域和量子计算系统的来宾编辑芯片和封装级通信感知架构
IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
IF
3.8
2024-09-01
0
PRE
AI
Das, Abhijit; Palesi, Maurizio; Kim, John; Pande, Partha Pratim
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Chip and Package-Scale Interconnects for General-Purpose, Domain-Specific, and Quantum Computing Systems-Overview, Challenges, and Opportunities
IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
IF
3.8
2024-09-01
1
OA
AI
Das, Abhijit; Palesi, Maurizio; Kim, John; Pratim Pande, Partha
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TEFLON: Thermally Efficient Dataflow-aware 3D NoC for Accelerating CNN Inferencing on Manycore PIM Architectures
TEFLON:一种热效率高且具有数据流感知能力的3D片上网络,用于加速多核近存计算架构上的卷积神经网络推理
ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS
IF
2.6
2024-08-14
1
OA
AI
Narang, G; Ogbogu, C; Doppa, JR; Pratim, P
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ReaLPrune: ReRAM Crossbar-Aware Lottery Ticket Pruning for CNNs
ReaLPrune: 为cnn进行ReRAM Crossbar感知彩票修剪
IEEE TRANSACTIONS ON EMERGING TOPICS IN COMPUTING
IF
5.4
2023-04-01
3
PRE
AI
Joardar, Biresh Kumar; Doppa, Janardhan Rao; Li, Hai; Chakrabarty, Krishnendu; Pande, Partha Pratim
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An Inductor-First Single-Inductor Multiple-Output Hybrid DC-DC Converter With Integrated Flying Capacitor for SoC Applications
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS
IF
5.2
2022-12-01
7
PRE
AI
Zhou, Zhiyuan; Tang, Nghia; Nguyen, Bai; Hong, Wookpyo; Pande, Partha Pratim; Krishnamurthy, Ram K.; Heo, Deukhyoun
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A A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS
IF
5.2
2020-11-01
6
OA
AI
Gopal, Srinivasan; Das, Sourav; Pande, Partha Pratim; Heo, Deukhyoun
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Analysis and Design Method of Multiple-Output Switched-Capacitor Voltage Regulators With a Reduced Number of Power Electronic Components
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS
IF
5.2
2020-09-01
6
PRE
AI
Hong, Wookpyo; Zhou, Zhiyuan; Nguyen, Bai; Tang, Nghia; Kim, Jonghoon; Pande, Partha Pratim; Heo, Deukhyoun
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Learning-Based Application-Agnostic 3D NoC Design for Heterogeneous Manycore Systems
IEEE TRANSACTIONS ON COMPUTERS
IF
3.8
2019-06-01
51
OA
AI
Joardar, Biresh Kumar; Kim, Ryan Gary; Doppa, Janardhan Rao; Pande, Partha Pratim; Marculescu, Diana; Marculescu, Radu
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A Spatial Multi-Bit Sub-1-V Time-Domain Matrix Multiplier Interface for Approximate Computing in 65-nm CMOS
IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
IF
3.8
2018-09-01
12
OA
AI
Gopal, Srinivasan; Agarwal, Pawan; Baylon, Joe; Renaud, Luke; Ali, Sheikh Nijam; Pande, Partha Pratim; Heo, Deukhyoun
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On-Chip Communication Network for Efficient Training of Deep Convolutional Networks on Heterogeneous Manycore Systems
片上通信网络,用于在异构众核系统上高效训练深度卷积网络
IEEE TRANSACTIONS ON COMPUTERS
IF
3.8
2018-05-01
67
OA
AI
Choi, Wonje; Duraisamy, Karthi; Kim, Ryan Gary; Doppa, Janardhan Rao; Pande, Partha Pratim; Marculescu, Diana; Marculescu, Radu
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研究方向
暂无研究方向
合作学者
合作期刊
K
Krishnendu Chakrabarty
H 指数: 80 · 论文数: 1.4K
李海
(Hai Li)
H 指数: 61 · 论文数: 694
R
Radu Mărculescu
H 指数: 57 · 论文数: 404
S
Swarup Bhunia
H 指数: 54 · 论文数: 599
J
John Kim
H 指数: 51 · 论文数: 370
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