未登录A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits通过共同设计的12 nm FinFET和硅光子集成电路的直接键合互连实现的3D集成节能收发器
Chang, Po-Hsuan; Samanta, Anirban; Yan, Peng; Fu, Mingye; Zhang, Yu; On, Mehmet Berkay; Kumar, Ankur; Kang, Hyungryul; Yi, Il-Min; Annabattuni, Dedeepya; Scott, David; Patti, Robert; Fan, Yang-Hang; Zhu, Yuanming; Palermo, Samuel; Yoo, S. J. Ben .png)
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收藏Fully-Integrated Heterogeneous DML Transmitters for High-Performance ComputingLiang, Di; Roshan-Zamir, Ashkan; Fan, Yang-Hang; Zhang, Chong; Wang, Binhao; Descos, Antoine; Shen, Wenqing; Yu, Kunzhi; Li, Cheng; Fan, Gaofeng; Kurczveil, Geza; Hu, Yingtao; Huang, Zhihong; Fiorentino, Marco; Kumar, Satish; Palermo, Samuel M.; Beausoleil, Raymond G. 分享 收藏 
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