Shijo Nagao - Publications, H-index & Citations

Shijo Nagao

the university of tokyo

46H指数

256论文数

6.1K被引数

收录论文 61

发表时间

Measurement of Λ Polarization in the π ¯ p → K0 Λ Reaction at pπ¯ = 1.33 GeV/c toward a New Λ p Scattering Experiment

Progress of Theoretical and Experimental Physics

IF8.3

2025-12-01

OAAI

T Sakao; K Miwa; J K Ahn; Y Akazawa; T Aramaki; S Ashikaga; S Callier; N Chiga; S W Choi; H Ekawa; P Evtoukhovitch; N Fujioka; M Fujita; T Gogami; T Harada; S Hasegawa; S H Hayakawa; R Honda; S Hoshino; K Hosomi; M Ichikawa; Y Ichikawa; M Ieiri; M Ikeda; K Imai; Y Ishikawa; S Ishimoto; W S Jung; S Kajikawa; H Kanauchi; H Kanda; B M Kang; H Kawai; S H Kim; T Kitaoka; K Kobayashi; T Koike; K Matsuda; Y Matsumoto; S Nagao; R Nagatomi; Y Nakada; M Nakagawa; I Nakamura; T Nanamura; M Naruki; S Ozawa; L Raux; T G Rogers; A Sakaguchi; H Sako; S Sato; T Shiozaki; K Shirotori; K N Suzuki; S Suzuki; M Tabata; C d L Taille; H Takahashi; T Takahashi; T N Takahashi; H Tamura; M Tanaka; K Tanida; Z Tsamalaidze; M Ukai; H Umetsu; S Wada; T O Yamamoto; J Yoshida; K Yoshimura; null

In situ nanoelectromechanical characterization of phase transformation in Si phononic crystal during nanoindentation

APL MATERIALS

IF4.5

2021-10-21

OAAI

Fujikane, Masaki; Takahashi, Kouhei; Tambo, Naoki; Kozaki, Takashi; Nagao, Shijo

Room-Temperature Plasticity of a Nanosized GaN Crystal

NANO LETTERS

IF9.1

2021-07-27

OAAI

Fujikane, Masaki; Nagao, Shijo; Chrobak, Dariusz; Yokogawa, Toshiya; Nowak, Roman

Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip SiC TEG芯片在功率循环测试过程中在线监测具有Ag烧结连接和无铅焊料的功率模块的热阻和可靠性特性

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2021-05-01

PREAI

Kim, Dongjin; Nagao, Shijo; Chen, Chuantong; Wakasugi, Naoki; Yamamoto, Yasuyuki; Suetake, Aiji; Takemasa, Tetsu; Sugahara, Tohru; Suganuma, Katsuaki

Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2021-04-01

OAAI

Choe, Chanyang; Chen, Chuantong; Nagao, Shijo; Suganuma, Katsuaki

Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses

JOURNAL OF MATERIALS SCIENCE

IF3.9

2021-02-25

PREAI

Kim, Dongjin; Lee, Sangmin; Chen, Chuantong; Lee, Seung-Joon; Nagao, Shijo; Suganuma, Katsuaki

Reactive wafer bonding with nanoscale Ag/Cu multilayers

SCRIPTA MATERIALIA

IF5.6

2020-07-01

PREAI

Liu, Yu-chen; Lin, Shih-kang; Zhang, Hao; Nagao, Shijo; Chen, Chuantong; Suganuma, Katsuaki

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

MICROMACHINES

IF3

2019-10-31

OAAI

Kim, Dongjin; Yamamoto, Yasuyuki; Nagao, Shijo; Wakasugi, Naoki; Chen, Chuantong; Suganuma, Katsuaki

Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion

JOURNAL OF MATERIALS SCIENCE

IF3.9

2019-09-20

PREAI

Iwashige, Tomohito; Endo, Takeshi; Sugiura, Kazuhiko; Tsuruta, Kazuhiro; Sakuma, Yuichi; Oda, Yukinori; Chen, Chuantong; Nagao, Shijo; Sugahara, Tohru; Suganuma, Katsuaki

Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size

APPLIED SURFACE SCIENCE

IF6.9

2019-08-01

OAAI

Zhang, Zheng; Chen, Chuantong; Liu, Guiming; Li, Caifu; Kurosaka, Seigo; Nagao, Shijo; Suganuma, Katsuaki

Ag particles for sinter bonding: Flakes or spheres?

APPLIED PHYSICS LETTERS

IF3.6

2019-06-27

PREAI

Yeom, Jeyun; Nagao, Shijo; Chen, Chuantong; Sugahara, Tohru; Zhang, Hao; Choe, Chanyang; Li, Cai-Fu; Suganuma, Katsuaki

Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles

APPLIED PHYSICS LETTERS

IF3.6

2019-04-23

PREAI

Sugiura, Kazuhiko; Iwashige, Tomohito; Tsuruta, Kazuhiro; Chen, Chuantong; Nagao, Shijo; Sugahara, Tohru; Suganuma, Katsuaki

Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air 铜与微米/亚微米Ag颗粒在空气中的低温无压烧结连接

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2019-04-01

121

OAAI

Zhang, Zheng; Chen, Chuantong; Yang, Yang; Zhang, Hao; Kim, Dongjin; Sugahara, Toru; Nagao, Shijo; Suganuma, Katsuaki

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

MATERIALS & DESIGN

IF7.9

2018-12-01

OAAI

Gao, Yue; Li, Wanli; Chen, Chuantong; Zhang, Hao; Jiu, Jinting; Li, Cai-Fu; Nagao, Shijo; Suganuma, Katsuaki

Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate

JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

IF14.3

2018-10-01

PREAI

Sun, Fu-Long; Gao, Li-Yin; Liu, Zhi-Quan; Zhang, Hao; Sugahara, Tohru; Nagao, Shijo; Suganuma, Katsuaki

Bonding technology based on solid porous Ag for large area chips

SCRIPTA MATERIALIA

IF5.6

2018-03-01

OAAI

Chen, Chuantong; Noh, Seungjun; Zhang, Hao; Choe, Chanyang; Jiu, Jinting; Nagao, Shijo; Suganuma, Katsuaki

Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2018-01-01

OAAI

Li, Wanli; Li, Lingying; Gao, Yue; Hu, Dawei; Li, Cai-Fu; Zhang, Hao; Jiu, Jinting; Nagao, Shijo; Suganuma, Katsuaki

Molecular dynamics study of deformation and fracture in SiC with angular dependent potential model

COMPUTATIONAL MATERIALS SCIENCE

IF3.3

2017-11-01

PREAI

Kubo, Atsushi; Nagao, Shijo; Umeno, Yoshitaka

Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution Zn-xsn高温钎料合金在0.5 M NaCl溶液中的电化学行为

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2017-09-01

OAAI

Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices 用于电力电子器件的微孔烧结Ag的宏观和微观断裂韧性

ACTA MATERIALIA

IF9.3

2017-05-01

PREAI

Chen, Chuantong; Nagao, Shijo; Suganuma, Katsuaki; Jiu, Jinting; Sugahara, Tohru; Zhang, Hao; Iwashige, Tomohito; Sugiura, Kazuhiko; Tsuruta, Kazuhiro

研究方向