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Jenq‐Gong Duh

department of materials science and engineering

52H指数
473论文数
1.1W被引数
收录论文 199
发表时间
Enhancing Mechanical Strength of Cu/In/Cu Microbump via Zn Doped Cu Substrate通过Zn掺杂Cu基板增强Cu/In/Cu微凸块的机械强度
err2026-03-05
err0
PREAI
errYuan-Tai Lai; Ta-Wei Lin; Zih-You Wu; Yin-Ku Lee; Zi-Xu Chen; Tsong-Pyng Perng; Jenq-Gong Duh
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Grain modification and formation of tough IMC phase in submicron Sn-Ag microbumps via doping Zn and Ni in Cu substrate
errVACUUM
IF3.9
err2023-11-01
err1
PREAI
errLee, Yin-Ku; Wu, Zih-You; Huang, Pin-Wei; Chao, Chen-Sung; Tsai, Su-Yueh; Chang, Shou-Yi; Duh, Jenq-Gong
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Hard yet tough thermodynamics-driven nanostructured (AlCrNbSixTi)N multicomponent nitride hard coating
err2023-06-01
err9
PREAI
errHsu, Sheng-Yu; Chi, Chong-Chi; Lu, Ming-Yen; Chang, Shou-Yi; Lai, Yuan-Tai; Tsai, Su-Yueh; Duh, Jenq-Gong
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Nano-scale mechanical characteristics of epitaxial stabilization ZrTiN/NbN superlattice coatings
err2023-01-01
err4
PREAI
errKu, Tsai-Ni; Hsu, Sheng-Yu; Lai, Yuan-Tai; Chang, Shou-Yi; Tsai, Su-Yueh; Duh, Jenq-Gong
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