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Nanoscale Three-Dimensional Imaging of Integrated Circuits Using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer 使用扫描电子显微镜和过渡边缘传感器光谱仪对集成电路进行纳米级三维成像 Nakamura, Nathan; Szypryt, Paul; Dagel, Amber L.; Alpert, Bradley K.; Bennett, Douglas A.; Doriese, William Bertrand; Durkin, Malcolm; Fowler, Joseph W.; Fox, Dylan T.; Gard, Johnathon D.; Goodner, Ryan N.; Harris, James Zachariah; Hilton, Gene C.; Jimenez, Edward S.; Kernen, Burke L.; Larson, Kurt W.; Levine, Zachary H.; Mcarthur, Daniel; Morgan, Kelsey M.; O'Neil, Galen C.; Ortiz, Nathan J.; Pappas, Christine G.; Reintsema, Carl D.; Schmidt, Daniel R.; Schultz, Peter A.; Thompson, Kyle R.; Ullom, Joel N.; Vale, Leila; Vaughan, Courtenay T.; Walker, Christopher; Weber, Joel C.; Wheeler, Jason W.; Swetz, Daniel S. 分享 收藏
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Impact of Incorporation Kinetics on Device Fabrication with Atomic Precision Ivie, Jeffrey A.; Campbell, Quinn; Koepke, Justin C.; Brickson, Mitchell, I; Schultz, Peter A.; Muller, Richard P.; Mounce, Andrew M.; Ward, Daniel R.; Carroll, Malcolm S.; Bussmann, Ezra; Baczewski, Andrew D.; Misra, Shashank 分享 收藏
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Assessment of projected temperature impacts from climate change on the U.S. electric power sector using the Integrated Planning Model® Jaglom, Wendy S.; McFarland, James R.; Colley, Michelle F.; Mack, Charlotte B.; Venkatesh, Boddu; Miller, Rawlings L.; Haydel, Juanita; Schultz, Peter A.; Perkins, Bill; Casola, Joseph H.; Martinich, Jeremy A.; Cross, Paul; Kolian, Michael J.; Kayin, Serpil 分享 收藏
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