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H
Hyeon Gyu Beom
Inha University
22
H指数
145
论文数
1.8K
被引数
0
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45
发表时间
发表时间
IF
被引数
Atomistic Modeling of the Fracture Toughness of a Copper Composite with Parallel Carbon Nanotubes for Through Silicon Via Application
铜复合材料的断裂韧性原子建模:含平行碳纳米管的硅通孔应用
ACS APPLIED NANO MATERIALS
IF
5.5
2025-05-06
0
PRE
AI
Shim, JS; Beom, HG
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Investigation of fracture behaviors in copper influenced by the angle of oblique edge nanocrack
JOURNAL OF MATERIALS SCIENCE
IF
3.9
2024-07-31
0
PRE
AI
Go, Dong Hyun; Shim, Jee Soo; Cui, Cheng Yu; Beom, Hyeon Gyu
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Mechanical degradation caused by interfacial vacancy defect in carbon-boron nitride heteronanotubes during axial compression tests
SURFACES AND INTERFACES
IF
6.3
2024-01-01
0
PRE
AI
Shim, Jee Soo; Beom, Hyeon Gyu
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Atomistic Investigation on the Blocking Phenomenon of Crack Propagation in Cu Substrate Reinforced by CNT
NANOMATERIALS
IF
4.3
2023-01-31
4
OA
AI
Shim, Jee Soo; Beom, Hyeon Gyu
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Atomistic Insights into the Phase Transformation of Single-Crystal Silicon during Nanoindentation
NANOMATERIALS
IF
4.3
2022-06-16
3
OA
AI
Chung, Young Jin; Lee, Gi Hun; Beom, Hyeon Gyu
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Mechanical Behaviors of Si/CNT Core/Shell Nanocomposites under Tension: A Molecular Dynamics Analysis
Si/CNT核/壳纳米复合材料拉伸力学行为的分子动力学分析
NANOMATERIALS
IF
4.3
2021-08-02
5
OA
AI
Shim, Jee Soo; Lee, Gi Hun; Cui, Cheng Yu; Beom, Hyeon Gyu
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Atomistic aspects of the temperature effect on fracture toughness of a silicon single crystal
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2021-07-01
4
PRE
AI
Lee, Gi Hun; Na, Sang Min; Chung, Young Jin; Beom, Hyeon Gyu
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Effects of Geometric and Crystallographic Factors on the Reliability of Al/Si Vertically Cracked Nanofilm/Substrate Systems
MATERIALS
IF
3.2
2021-06-25
2
OA
AI
Shim, Jee S.; Go, Dong H.; Beom, Hyeon G.
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Mixed-mode fracture toughness testing of a Cu/Ag bimetallic interface via atomistic simulations
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2020-10-01
3
PRE
AI
Lee, Gi Hun; Beom, Hyeon Gyu
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Cohesive Zone Modeling of Crack Propagation in FCC Single Crystals via Atomistic Simulations
METALS AND MATERIALS INTERNATIONAL
IF
4
2020-03-31
13
PRE
AI
Lee, Gi Hun; Kim, Jang Hyun; Beom, Hyeon Gyu
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Cohesive zone representation of interfacial fracture in aluminum-silicon bimaterials
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2019-11-01
7
PRE
AI
Zhuo, Xiao Ru; Ma, Aibin; Beom, Hyeon Gyu
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Hydrogen-induced cracking of an aluminum single crystal: An atomistic simulation
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2019-11-01
7
PRE
AI
Lee, Gi Hun; Shim, Jee Soo; Cui, Cheng Yu; Beom, Hyeon Gyu
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Atomistic study of the bending properties of silicon nanowires
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2018-09-01
18
PRE
AI
Zhuo, X. R.; Beom, H. G.
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Atomistic simulations on intergranular fracture toughness of copper bicrystals with symmetric tilt grain boundaries
具有对称倾斜晶界的铜双晶晶晶间断裂韧性的原子模拟
METALS AND MATERIALS INTERNATIONAL
IF
4
2018-01-06
2
PRE
AI
Cui, Cheng Bin; Beom, Hyeon Gyu
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Mixed-mode fracture toughness evaluation of a copper single crystal using atomistic simulations
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2017-08-01
14
PRE
AI
Cui, Cheng Bin; Lee, Gi Hun; Beom, Hyeon Gyu
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Fracture of nanoscale Cu/Ag bimaterials with an interface crack
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2016-06-01
4
PRE
AI
Cui, Cheng Bin; Beom, Hyeon Gyu
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Size-dependent fracture properties of cracked silicon nanofilms
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF
7
2015-06-01
24
PRE
AI
Zhuo, X. R.; Beom, H. G.
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Molecular statics simulations of the size-dependent mechanical properties of copper nanofilms under shear loading
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2015-03-01
9
PRE
AI
Zhuo, X. R.; Beom, H. G.
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Molecular statics simulations of intergranular fracture along I£11 tilt grain boundaries in copper bicrystals
JOURNAL OF MATERIALS SCIENCE
IF
3.9
2014-08-21
21
PRE
AI
Cui, C. B.; Beom, H. G.
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Molecular dynamics simulations of edge cracks in copper and aluminum single crystals
铜铝单晶边裂纹的分子动力学模拟
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF
7
2014-07-01
64
PRE
AI
Cui, C. B.; Beom, H. G.
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