S. Reaz Ahmed - Publications, H-index & Citations

S. Reaz Ahmed

university of technology- iraq

14H指数

81论文数

702被引数

收录论文 13

发表时间

Self-monitoring of intelligent engineered cementitious composite (IECC) and the role of certain fillers in electrical and mechanical properties: a review 智能工程水泥基复合材料（IECC）的自监测及其特定填料在电学和力学性能中的作用：综述

Engineering Research Express

IF1.6

2026-01-01

PREAI

Abdullah, Raid D.; Ahmed, Shatha R.; Al-Dahawi, Ali M.; Khudair, Ali Muneer

Thermomechanical modeling of dissimilar-material interfaces in composite structures

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

IF9.4

2024-03-01

PREAI

Ahmed, S. Reaz; Nath, Methu Dev; Amin, M. Farhan; Datta, Bibekananda

Strain-rate dependency and impact dynamics of closed-cell aluminium foams 闭孔泡沫铝的应变率依赖性和冲击动力学

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2021-06-01

PREAI

Kader, M. A.; Hazell, P. J.; Islam, M. A.; Ahmed, S.; Hossain, M. M.; Escobedo, J. P.; Saadatfar, M.

On the investigation of reuse potential of SnPb-solder affected copper subjected to work-hardening and thermal ageing

MATERIALS CHARACTERIZATION

IF5.5

2021-02-01

PREAI

Rahman, M. Muzibur; Ahmed, S. Reaz; Kaiser, M. Salim

Nanometre-scale optical property fluctuations in Cu2ZnSnS4 revealed by low temperature cathodoluminescence

SOLAR ENERGY MATERIALS AND SOLAR CELLS

IF6.3

2018-01-01

OAAI

Mendis, B. G.; Taylor, A. A.; Guennou, M.; Berg, D. M.; Arasimowicz, M.; Ahmed, S.; Deligianni, H.; Dale, P. J.

Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2014-05-23

PREAI

Huang, Q.; Avekians, A.; Ahmed, S.; Parks, C.; Baker-O'Neal, B.; Kitayaporn, S.; Sahin, A.; Sun, Y.; Cheng, T.

Electrodeposited Gallium Alloy Thin Films Synthesized by Solid State Reactions for CIGS Solar Cell

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2011-01-01

PREAI

Ahmed, S.; Reuter, K. B.; Huang, Q.; Deligianni, H.; Romankiw, L. T.; Jaime, S.; Grand, P. P.

Centimetre scale assembly of vertically aligned and close packed semiconductor nanorods from solution

CHEMICAL COMMUNICATIONS

IF4.2

2009-01-01

OAAI

Ahmed, S.; Ryan, Kevin M.

Heat conduction in a symmetric body subjected to a current flow of symmetric input and output

INTERNATIONAL JOURNAL OF THERMAL SCIENCES

IF5

2009-01-01

PREAI

Saka, M.; Sun, Y. X.; Ahmed, S. Reaz

Close-Packed Gold-Nanocrystal Assemblies Deposited with Complete Selectivity into Lithographic Trenches

ADVANCED MATERIALS

IF26.8

2008-12-16

PREAI

Ahmed, S.; Ryan, Kevin M.

Self-assembly of vertically aligned nanorod supercrystals using highly oriented pyrolytic graphite

NANO LETTERS

IF9.1

2007-07-18

117

OAAI

Ahmed, S.; Ryan, Kevin M.

An isothermal annealing study of spontaneous morphology change in electrodeposited copper metallization

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2007-01-01

PREAI

Ahmed, S.; Buckley, D. N.; Nakahara, S.; Ahmed, T. T.; Kuo, Y.

Vacancy-induced plastic deformation in electrodeposited copper films

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2007-01-01

PREAI

Nakahara, S.; Ahmed, S.; Ahmed, T. T.; Buckley, D. N.

研究方向