杨

杨防祖 (Fang-Zu Yang)

xiamen university

H指数:18

被引数:1,166

个人简介

暂无内容

教育背景

暂无内容

工作经历

暂无内容

荣誉奖项

暂无内容

Revealing Pd-P Deposition Behavior in Advanced Electroless Nickel/Electroless Palladium/ Immersion Gold Multilayer Plating for Electronic Packaging

揭示电子封装中化学镀镍/化学镀钯/置换镀金多层镀层中Pd-P沉积行为

Electrochimica Acta

IF5.6

2026-10-210

PRE

Understanding Molecular Properties of Bismarck Brown R and Its Effects on the Electroreduction of Copper Ions at a Polarized Interface: Toward Void-Free Filling of Microvia

理解Bismarck Brown R分子性质及其对极化界面上铜离子电还原的影响：迈向无空洞微孔填充

Langmuir

IF3.9

2026-04-170

PRE

Complexation Mechanism of a Novel Alkaline Cu(I) Electroplating System Investigated by UV–Visible Spectroscopy

一种新型碱性Cu(I)电镀体系的络合机制研究：基于UV–Visible光谱法

Analytical Chemistry

IF6.7

2026-04-080

PRE

Unveiling the volcano relationship between adsorption ability of tetrazolium levelers and their microvia filling performance in acidic copper electroplating bath

Electrochimica Acta

IF5.6

2026-02-070

PRE

Study on the structural properties of an imidazole derivative synthesized based on the schiff base reaction and its effects as a leveler on microvia copper electroplating

基于席夫碱反应合成的一种咪唑衍生物的结构性质研究及其作为整平剂对微孔铜电镀的影响

Journal of Electroanalytical Chemistry

IF4.1

2025-10-100

PRE

Synthesis of Quaternary Ammonium Gemini Levelers and Their Action Mechanisms in Microvias Void-Free Copper Filling

季铵盐 Gemini 平滑剂的合成及其在微孔无空洞铜填充中的作用机制

COLLOIDS AND INTERFACES

IF0

2025-09-150

OAAI

Potential- and Convection-Dependent Synergistic Coadsorption of Electroplating Additives for Vias Copper Interconnection Evidenced by Shell-Isolated Nanoparticle-Enhanced Raman Spectroscopy

电位与对流依赖性的电镀添加剂协同共吸附用于通孔铜互连，并通过壳隔离纳米粒子增强拉曼光谱证实

Analytical Chemistry

IF6.7

2025-08-040

PRE

Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling

非传统硫脲类添加剂1-苯基-2-硫脲用于微孔无空洞填充的缓蚀剂作用机理研究

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2025-04-220

PRE

Molecular structure with adsorption behavior of butynediol and its effects on cobalt electrodeposition

丁炔二醇的分子结构与吸附行为及其对钴电沉积的影响

MATERIALS TODAY COMMUNICATIONS

IF4.5

2025-04-011

PRE

From electrochemical kinetics to evaluate the through hole thickening throwing power of an acidic copper solution

JOURNAL OF ELECTROANALYTICAL CHEMISTRY

IF4.1

2025-01-010

PRE

Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating

JOURNAL OF ELECTROANALYTICAL CHEMISTRY

IF4.1

2024-07-012

PRE

Phase transformation sequence of amorphous nickel-molybdenum electrodeposit

MATERIALS TODAY COMMUNICATIONS

IF4.5

2024-06-011

PRE

Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling

SURFACES AND INTERFACES

IF6.3

2024-01-017

OAAI

Advanced Ag nanoparticles for the catalyzation of glyoxylic acid oxidation in through-holes electroless copper metallization

JOURNAL OF COLLOID AND INTERFACE SCIENCE

IF9.7

2023-10-014

PRE

1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating

JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY

IF6

2023-09-0110

PRE

Confined Etchant Layer Technique: An Electrochemical Approach to Micro-/Nanomachining

JOURNAL OF PHYSICAL CHEMISTRY C

IF3.2

2023-07-063

PRE

A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening

用于正向理解添加剂在通孔均匀铜增厚中的协同作用的转移吸附模型

JOURNAL OF ELECTROANALYTICAL CHEMISTRY

IF4.1

2023-05-0112

PRE

Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)4- coordination ions

ELECTROCHIMICA ACTA

IF5.6

2023-01-010

PRE

Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application

ACS SUSTAINABLE CHEMISTRY & ENGINEERING

IF7.3

2022-10-2023

PRE

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

CHEMELECTROCHEM

IF3.5

2022-06-078

PRE

杨防祖 (Fang-Zu Yang)

个人简介

教育背景

工作经历

荣誉奖项

研究方向