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S

S. V. Babu

University of Texas Dallas

47H指数
242论文数
5.9K被引数
收录论文 41
发表时间
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Two decades of ceria nanoparticle research: structure, properties and emerging applications
errMATERIALS HORIZONS
IF10.7
err2024-01-01
err7
PREAI
errOthman, Ali; Gowda, Akshay; Andreescu, Daniel; Hassan, Mohamed H.; Babu, S. V.; Seo, Jihoon; Andreescu, Silvana
err分享
err收藏
Transport phenomena in chemical mechanical polishing
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err38
PREAI
errSubramanian, RS; Zhang, L; Babu, SV
err分享
err收藏
Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments
errENVIRONMENTAL SCIENCE-NANO
IF5.1
err2015-01-01
err77
PREAI
errSpeed, David; Westerhoff, Paul; Sierra-Alvarez, Reyes; Draper, Rockford; Pantano, Paul; Aravamudhan, Shyam; Chen, Kai Loon; Hristovski, Kiril; Herckes, Pierre; Bi, Xiangyu; Yang, Yu; Zeng, Chao; Otero-Gonzalez, Lila; Mikoryak, Carole; Wilson, Blake A.; Kosaraju, Karshak; Tarannum, Mubin; Crawford, Steven; Yi, Peng; Liu, Xitong; Babu, S. V.; Moinpour, Mansour; Ranville, James; Montano, Manuel; Corredor, Charlie; Posner, Jonathan; Shadman, Farhang
err分享
err收藏
Use of anionic surfactants for selective polishing of silicon dioxide over silicon nitride films using colloidal silica-based slurries
errAPPLIED SURFACE SCIENCE
IF6.9
err2013-10-01
err34
PREAI
errPenta, Naresh K.; Amanapu, H. P.; Peethala, B. C.; Babu, S. V.
err分享
err收藏
Cobalt Polishing with Reduced Galvanic Corrosion at Copper/Cobalt Interface Using Hydrogen Peroxide as an Oxidizer in Colloidal Silica-Based Slurries
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2012-01-01
err100
PREAI
errPeethala, B. C.; Amanapu, H. P.; Lagudu, U. R. K.; Babu, S. V.
err分享
err收藏
Charge Density and pH Effects on Polycation Adsorption on Poly-Si, SiO2, and Si3N4 Films and Impact on Removal During Chemical Mechanical Polishing
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2011-10-06
err19
PREAI
errPenta, Naresh K.; Veera, P. R. Dandu; Babu, S. V.
err分享
err收藏
Role of Poly(diallyldimethylammonium chloride) in Selective Polishing of Polysilicon over Silicon Dioxide and Silicon Nitride Films
errLANGMUIR
IF3.9
err2011-02-28
err30
PREAI
errPenta, Naresh K.; Veera, P. R. Dandu; Babu, S. V.
err分享
err收藏
Chemical Mechanical Polishing of Ge in Hydrogen Peroxide-Based Silica Slurries: Role of Ionic Strength
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2011-01-01
err28
PREAI
errMatovu, J. B.; Penta, N. K.; Peddeti, S.; Babu, S. V.
err分享
err收藏
Ruthenium Polishing Using Potassium Periodate as the Oxidizer and Silica Abrasives
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2011-01-01
err70
PREAI
errPeethala, B. C.; Babu, S. V.
err分享
err收藏
Silicon Nitride Film Removal During Chemical Mechanical Polishing Using Ceria-Based Dispersions
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2011-01-01
err25
PREAI
errDandu, P. R. Veera; Peethala, B. C.; Amanapu, H. P.; Babu, S. V.
err分享
err收藏
Impact of stratification on internal waves and differential wearing of thermal inversions on the east coast of India
errNATURAL HAZARDS
IF3.7
err2010-09-21
err6
PREAI
errRao, A. D.; Babu, S. V.; Murty, P. L. N.; Pandey, Smita
err分享
err收藏
Mixing in the surface layers in association with internal waves during winter in the northwestern Bay of Bengal
errNATURAL HAZARDS
IF3.7
err2010-09-03
err12
PREAI
errBabu, S. V.; Rao, A. D.
err分享
err收藏
Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films
errJOURNAL OF COLLOID AND INTERFACE SCIENCE
IF9.7
err2010-08-01
err11
PREAI
errDandu, P. R. Veera; Penta, Naresh K.; Peethala, B. C.; Babu, S. V.
err分享
err收藏
Reverse selectivity - High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions
errJOURNAL OF COLLOID AND INTERFACE SCIENCE
IF9.7
err2010-07-01
err35
PREAI
errDandu, P. R. Veera; Devarapalli, V. K.; Babu, S. V.
err分享
err收藏
Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2010-01-01
err61
PREAI
errDandu, P. R. Veera; Peethala, B. C.; Babu, S. V.
err分享
err收藏
Selective Chemical Mechanical Polishing of Silicon Dioxide over Silicon Nitride for Shallow Trench Isolation Using Ceria Slurries
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err44
PREAI
errVeera, P. R. Dandu; Peddeti, Shivaji; Babu, S. V.
err分享
err收藏
Chemical Mechanical Polishing of Methyl Silsesquioxane甲基倍半硅氧烷的化学机械抛光
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err3
errOAAI
errMeled, V.; Babu, S. V.; Matijevic, E.
err分享
err收藏
Selective Polishing of Polysilicon during Fabrication of Microelectromechanical Systems Devices
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err29
PREAI
errVeera, P. R. Dandu; Natarajan, A.; Hegde, S.; Babu, S. V.
err分享
err收藏
Colloid aspects of chemical-mechanical planarization
errJOURNAL OF COLLOID AND INTERFACE SCIENCE
IF9.7
err2008-04-01
err106
PREAI
errMatijevic, E.; Babu, S. V.
err分享
err收藏
Dissolution Inhibition in Cu-CMP Using Dodecyl-Benzene-Sulfonic Acid Surfactant with Oxalic Acid and Glycine as Complexing Agents
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2008-01-01
err21
PREAI
errSurisetty, C. V. V. S.; Goonetilleke, P. C.; Roy, D.; Babu, S. V.
err分享
err收藏

研究方向

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