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H

Hyoungjae Kim

Korea Institute of Industrial Technology

17H指数
79论文数
1.1K被引数
收录论文 10
发表时间
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Correlation between structured surface pad design and material removal rate in Chemical Mechanical Polishing化学机械抛光中结构化表面垫设计与材料去除率之间的关系
errJournal of Manufacturing Processes
IF6.8
err2025-11-19
err0
PREAI
errYoungwook Park; Hokyoung Jung; Hanchul Cho; Doyeon Kim; Taekyung Lee; Haedo Jeong; Hyoungjae Kim
err分享
err收藏
Particle removal behavior of micropatterned pad buffing in post-CMP cleaning微图案垫抛光在CMP后清洗中的粒子去除行为
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-06-17
err0
errOAAI
errJung, Hokyoung; Park, Youngwook; Cho, Hanchul; Kim, Doyeon; Lee, Taekyung; Jeong, Haedo; Kim, Hyoungjae
err分享
err收藏
Ultrahigh Power Output from Triboelectric Nanogenerator Based on Serrated Electrode via Spark Discharge
errADVANCED ENERGY MATERIALS
IF26
err2020-10-07
err45
PREAI
errKim, Jihye; Cho, Hanchul; Han, Maeum; Jung, Young; Kwak, Sung Soo; Yoon, Hong-Joon; Park, Byunggeon; Kim, Hyeok; Kim, Hyoungjae; Park, Jinhyoung; Kim, Sang-Woo
err分享
err收藏
Effect of the Lapping Platen Groove Density on the Characteristics of Microabrasive-Based Lapping
errMICROMACHINES
IF3
err2020-08-14
err6
errOAAI
errLee, Taekyung; Jeong, Haedo; Lee, Sangjik; Kim, Doyeon; Kim, Hyoungjae
err分享
err收藏
Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires
errCIRP ANNALS-MANUFACTURING TECHNOLOGY
IF3.6
err2013-01-01
err41
PREAI
errKim, Hyoungjae; Kim, Doyeon; Kim, Chulmin; Jeong, Haedo
err分享
err收藏
A hybrid polysilicon planarization for suppressing dishing defects
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2012-12-01
err1
PREAI
errPark, Sungmin; Yoon, Sang-Hee; Kim, Hyoungjae; Jeong, Haedo
err分享
err收藏
Effect of mechanical factor in uniformity for electrochemical mechanical planarization
errSENSORS AND ACTUATORS A-PHYSICAL
IF4.9
err2010-09-01
err10
PREAI
errJeong, Sukhoon; Bae, Jaehyun; Lee, Hyunseop; Lee, Hojun; Lee, Youngkyun; Park, Boumyoung; Kim, Hyoungjae; Kim, Sungryul; Jeong, Haedo
err分享
err收藏
Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization
errAPPLIED SURFACE SCIENCE
IF6.9
err2010-01-01
err16
PREAI
errJeong, Sukhoon; Lee, Hyunseop; Cho, Hanchul; Lee, Sangjik; Kim, Hyoungjae; Kim, Sungryul; Park, Jaehong; Jeong, Haedo
err分享
err收藏
Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2008-07-01
err43
PREAI
errPark, Boumyoung; Lee, Hyunseop; Park, Kihyun; Kim, Hyoungjae; Jeong, Haedo
err分享
err收藏
Heat and its effects to chemical mechanical polishing热及其对化学机械抛光的影响
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2006-09-01
err29
PREAI
errKwon, Daehee; Kim, Hyoungjae; Jeong, Haedo
err分享
err收藏

研究方向

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合作学者
合作期刊
S
Sang‐Woo Kim
H 指数: 115 · 论文数: 1.2K
S
Sung‐Min Park
H 指数: 51 · 论文数: 864
H
Hong‐Joon Yoon
H 指数: 38 · 论文数: 92
S
Sung Soo Kwak
H 指数: 38 · 论文数: 66
J
Jaehong Park
H 指数: 32 · 论文数: 199
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