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Min Shang

Yunnan University

15H指数
102论文数
1.0K被引数
收录论文 29
发表时间
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Microstructural evolution and interfacial behavior of joints brazed with Sn-modified low-silver Ag-Cu-Ge medium-temperature filler metals用Sn改性的低银Ag-Cu-Ge中温钎料钎焊接头的微观结构演变和界面行为
errMaterials Characterization
IF5.5
err2026-10-02
err0
PREAI
errJunhao Mao; Kai Xiong; Shunmeng Zhang; Zhilong Tan; Yingwu Wang; Lei Guo; Min Shang; Xiaoguang Tang; Haijun Wu
err分享
err收藏
Interfacial reaction kinetics and mechanical reliability of pure indium solder on Ni(P) substrate纯铟焊料在Ni(P)基板上的界面反应动力学及机械可靠性
errMaterials Characterization
IF5.5
err2026-07-01
err0
PREAI
errAyi, Qujin; Shang, Min; Xiong, Kai; Wang, Yingwu; Li, Zhihua; Luo, Xiaobin; Lei, Desheng; Liu, Ruixin; Chen, Yichong; Luo, Shaoqiu
err分享
err收藏
Shear behavior and failure modes of rock-like specimens with parallel flaws含平行裂隙的岩石类试样的剪切行为与破坏模式
errTheoretical and Applied Fracture Mechanics
IF5.6
err2025-11-18
err0
PREAI
errJianhua Yan; Xiansen Xing; Chun Zhu; Yingze Xu; Yuanyuan He; Min Shang
err分享
err收藏
Microstructure and mechanical properties of Sn58Bi composite solder reinforced with carbon nanotubes and nano-nickelSn58Bi复合焊料的微观结构和力学性能，该焊料由碳纳米管和纳米镍增强。
errJournal of Materials Science: Materials in Electronics
IF0
err2025-11-03
err0
PREAI
errJingLi Ke; Min Shang; ChenYu Li; WenLong Yang; JinWei Cao; JiaJun Wang; YunPeng Wang; HaiTao Ma
err分享
err收藏
Time-dependent reversal of size effect on interfacial reaction in rapidly quenched Sn-58Bi/Cu solder joints: A shift in rate-limiting mechanism governed by Bi segregation时间依赖性对快速淬火Sn-58Bi/Cu焊点界面反应中尺寸效应的逆转：由Bi偏聚控制的速率限制机制转变
errMaterials Characterization
IF5.5
err2025-10-28
err0
PREAI
errMin Shang; Jiajun Wang; Hang Liu; Ruiqi Liu; Yunpeng Wang; Haitao Ma
err分享
err收藏
Spatiotemporal dynamics of crop residue utilization drive regional carbon mitigation in China作物残留物利用的时空动态驱动中国区域碳减排
errScientific Reports
IF3.9
err2025-10-03
err0
errOAAI
errZhijuan Yang; Min Shang; Jiang Sun; Chenghan Chen; Yanwei Wang; Guoquan Hu; Qili Zhu
err分享
err收藏
Effect of Surface Finishes on the Microstructure and Shear-Speed-Dependent Mechanical Properties of Sn-Ag-Cu-Based Solder Joints
errJournal of Electronic Materials
IF2.5
err2025-10-01
err0
PREAI
errWang, Jiajun; Shang, Min; Luo, Xiaobin; Wang, Qin; Lu, Hongbo; Zhao, Lingyan; Wang, Yunpeng; Ma, Haitao; Wang, Xiaojing; Yan, David P.
err分享
err收藏
Direct formation of Cu3Sn at Sn-Bi/Cu interfaces: a thermodynamic and kinetic perspectiveSn-Bi/Cu界面处Cu3Sn的直接形成：热力学与动力学视角
errApplied Surface Science
IF6.9
err2025-09-03
err0
PREAI
errMin Shang; Jinye Yao; Jiajun Wang; Yunpeng Wang; Haitao Ma; Haoran Ma
err分享
err收藏
In situ study of the effect of bias voltage on the electrochemical migration behavior of Sn58Bi solder alloy原位研究偏压电压对Sn58Bi焊料合金电化学迁移行为的影响
errElectrochimica Acta
IF5.6
err2025-08-27
err0
PREAI
errFuye Lu; Han Sun; Xiangqing Liu; Yulong Wang; Min Shang; Yunpeng Wang; Jinye Yao; Haitao Ma
err分享
err收藏
Shock consolidation and spallation in nanopowdered Mg: Contributed by deformation twinning and disordering冲击固结与纳米粉末Mg的层裂：由变形孪晶和无序化引起
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2025-07-01
err1
PREAI
errWang, M. Y.; He, D. B.; Bi, W. B.; Shang, M.; Cai, Y.; Deng, L.; Zhang, X. M.; Zhao, F.; Tang, J. F.; Wang, L.
err分享
err收藏
Study of Electrochemical Migration Behavior of Sn1.0Ag SolderSn1.0Ag焊料的电化学迁移行为研究
errMETALS
IF2.5
err2025-04-12
err0
errOAAI
errZhou, Tianshuo; Lu, Fuye; Shang, Min; Wang, Yunpeng; Ma, Haitao
err分享
err收藏
IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-11-01
err2
errOAAI
errShang, Min; Li, Chenyu; Wang, Yanchen; Chen, Xiangxu; Zhao, Yuanbang; Ke, Jingli; Wang, Yunpeng; Ma, Haitao; Chen, Jun
err分享
err收藏
Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction
errMATERIALS
IF3.2
err2024-07-25
err1
errOAAI
errYao, Jinye; Li, Chenyu; Shang, Min; Chen, Xiangxu; Wang, Yunpeng; Ma, Haoran; Ma, Haitao; Liu, Xiaoying
err分享
err收藏
Titanium Alloy Materials with Very High Cycle Fatigue: A Review
errMATERIALS
IF3.2
err2024-06-18
err1
errOAAI
errWu, Yuhang; He, Weifeng; Ma, Haitao; Nie, Xiangfan; Liang, Xiaoqing; Pan, Jile; Wang, Shiguang; Shang, Min; Cheng, Li
err分享
err收藏
Preparation and soldering performance of SAC305@Sn-bi Core-shell solder balls based on eutectic co-deposition共晶共沉积SAC305 @ sn-bi核壳焊球的制备及焊接性能
errMATERIALS CHARACTERIZATION
IF5.5
err2024-05-01
err1
PREAI
errShang, Min; Yao, Jinye; Zhang, Dan; Su, Xiaolin; Ma, Haitao; Wang, Yunpeng; Ma, Haoran
err分享
err收藏
Deformation evaluation and displacement forecasting of baishuihe landslide after stabilization based on continuous wavelet transform and deep learning基于连续小波变换和深度学习的白水河滑坡稳定后变形评价及位移预测
errNATURAL HAZARDS
IF3.7
err2024-04-21
err5
errOAAI
errLiu, Yuting; Teza, Giordano; Nava, Lorenzo; Chang, Zhilu; Shang, Min; Xiong, Debing; Cola, Simonetta
err分享
err收藏
Effect of substrate surface roughness on interfacial reaction at Sn-3.0Ag/(001)Cu interface
errVACUUM
IF3.9
err2022-03-01
err7
PREAI
errDong, Chong; Shang, Min; Ma, Haoran; Wang, Yunpeng; Ma, Haitao
err分享
err收藏
Mechanism on the nucleation of orientation-preferred Cu6Sn5 at different temperatures and solder compositions
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2022-03-01
err10
PREAI
errDong, Chong; Shang, Min; Ma, Haoran; Wang, Yunpeng; Li, Xiaogan; Ma, Haitao
err分享
err收藏
Toxic footprint and materials profile of electronic components in printed circuit boards
errWASTE MANAGEMENT
IF7.1
err2022-03-01
err6
errOAAI
errHuang, Jinfeng; Deng, Yi; Han, Yunhui; Shu, Jiancheng; Wang, Rong; Huang, Sheng; Ogunseitan, Oladele A.; Yu, Keli; Shang, Min; Liu, Yi; Li, Shuyuan; Han, Yubin; Cheng, Zhiqiang; Chen, Mengjun
err分享
err收藏
Investigation on growth of the orientation-preferred Cu6Sn5 on (001)Cu during the temperature-increased multiple reflow process
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2021-12-01
err9
PREAI
errDong, Chong; Shang, Min; Chen, Fei; Wang, Yunpeng; Li, Xiaogan; Ma, Haoran; Ma, Haitao
err分享
err收藏

研究方向

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