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K

K. N. Tu

City University of Hong Kong

81H指数
651论文数
2.3W被引数
收录论文 117
发表时间
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The study of rapid Cu–Cu bonding using thermally stable nanostructured Cu layers使用热稳定纳米结构Cu层进行快速Cu–Cu键合的研究
errApplied Surface Science
IF6.9
err2025-12-03
err0
errOAAI
errShichen Xie; Zishan Xiong; Ziting Ye; Yuanxing Duan; Fuxin Du; K.N. Tu; Yingxia Liu
err分享
err收藏
Effects of whey protein isolate heating temperature on formation and stabilization of arabinoxylan-whey protein isolate based Pickering emulsions乳清蛋白分离物加热温度对阿拉伯木聚糖-乳清蛋白分离物基Pickering乳液形成和稳定性的影响
errLWT
IF0
err2025-11-04
err0
errOAAI
errRuihong Ge; Jinyang Li; Keyu Tu; Hui Wang
err分享
err收藏
Influence of temperature on the bonding behavior of GaN on diamond with Ta-Au interlayer: Insights from molecular dynamics simulations温度对Ta-Au中间层上GaN与金刚石结合行为的影响：分子动力学模拟的见解
errDiamond and Related Materials
IF5.1
err2025-10-27
err0
PREAI
errShilin Li; Xingyu Chen; Fuchu Liu; Hongyong Jiang; Jianing Li; King-Ning Tu; Qinglei Sun
err分享
err收藏
Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test新型共晶SnBi焊点在同时进行电迁移和温度循环测试下的加速失效模式
errJournal of Materials Science: Materials in Electronics
IF0
err2025-10-24
err0
errOAAI
errZesheng Shen; Yuxuan An; Yifan Yao; Qinglei Sun; King-Ning Tu; Yingxia Liu
err分享
err收藏
Piezocatalysis-Enabled High-Efficiency Hydrogen Evolution with Single-Atom Platinum on MoS2 Nanoflowers压电催化赋能的高效氢气 evolution 单原子铂基 MoS2 纳米花
errSmall
IF12.1
err2025-10-06
err0
PREAI
errYu-Ming Chen; Yu-Ching Chen; Kuang-Yuan Tu; Yi-Dong Lin; Yan-Gu Lin; Hsun-Yen Lin; Samiksha Bajaj; Jyh Ming Wu
err分享
err收藏
Elucidating electromigration-induced void failures in Ni/SnAg/Ni solder microbumps using 3D X-ray laminographic inspections利用3D X射线层析扫描技术揭示Ni/SnAg/Ni焊料微凸点中电迁移诱发的空洞失效
errMaterials Characterization
IF5.5
err2025-09-24
err0
PREAI
errShih-Chi Yang; Chi-Hau Wu; Kai-Cheng Shie; King-Ning Tu; Chih Chen
err分享
err收藏
PEDOT:PSS-Loaded Gelatin Cryogels for Electrically Controlled Drug ReleasePEDOT:PSS负载明胶冷冻凝胶用于电控药物释放
errACS Omega
IF4.3
err2025-07-17
err0
errOAAI
errHuai-An Chen; Ching-Yu Lee; Bo-Jun Huang; Kai-Yun Tu; Pei-Hsuan Sung; Le Ngoc Hoang; Ching-Li Tseng
err分享
err收藏
Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution linesSiCN钝化对纳米孪晶Cu再分布线路电迁移可靠性的影响
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-05-01
err0
errOAAI
errHung, Yu-Wen; La, Mai-Phuong; Lin, Yi-Quan; Tu, K. N.
err分享
err收藏
Softening-resistant ultra-strong nanotwinned CoCrFeNi medium entropy alloy thin films抗软化超强纳米孪晶CoCrFeNi中熵合金薄膜
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2025-04-01
err0
PREAI
errWang, Jian-Jie; Tsai, Cheng-Yuan; Chang, Shou-Yi; Tu, King-Ning; Ouyang, Fan-Yi
err分享
err收藏
Unraveling the effect of Sn crystallographic orientation on electromigration-induced intermetallic compounds formations in Cu/Ni/ SnAg/Ni/Cu microbumps揭示Sn晶体学取向对电迁移诱导的Cu/Ni/SnAg/Ni/Cu微凸点中金属间化合物形成的影响
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-04-01
err0
PREAI
errYang, Shih-Chi; Su, Hung-Chieh; Tu, King-Ning
err分享
err收藏
Mechanical characterizations of η ′-Cu 6 (Sn, In) 5 intermetallic compound solder joint: Getting prepared for future nanobumpsΗ ′-Cu 6 (Sn，In) 5金属间化合物焊点的机械特性: 为未来的纳米棒做准备
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-05-01
err3
errOAAI
errMao, Xingchao; An, Yuxuan; Chen, Yang; Zheng, Gong; Hou, Rui; Zhang, Xinyu; Guo, Yuzheng; Liu, Sheng; Tu, King-Ning; Liu, Yingxia
err分享
err收藏
Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology电迁移与焦耳热耦合对3D集成电路技术球栅阵列失效的影响
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-01-01
err5
errOAAI
errYao, Yifan; An, Yuxuan; Tu, K. N.; Liu, Yingxia
err分享
err收藏
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints通过x射线纳米衍射测量Cu/SiO2杂化接头的 (111) 取向纳米孪晶Cu凸块中的热应力
errNANOMATERIALS
IF4.3
err2023-08-29
err7
errOAAI
errHsu, Wei-You; Yang, Shih-Chi; Lin, You-Yi; Hsieh, Wan-Zhen; Tu, King-Ning; Chiu, Wei-Lan; Chang, Hsiang-Hung; Chiang, Ching-Yu; Chen, Chih
err分享
err收藏
Electromigration in three-dimensional integrated circuits
errAPPLIED PHYSICS REVIEWS
IF11.6
err2023-05-16
err18
PREAI
errShen, Zesheng; Jing, Siyi; Heng, Yiyuan; Yao, Yifan; Tu, K. N.; Liu, Yingxia
err分享
err收藏
To suppress thermomigration of Cu-Sn intermetallic compounds in flip-chip solder joints抑制倒装芯片焊点中cu-sn金属间化合物的热迁移
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-05-01
err6
errOAAI
errHuang, Yan-Rong; Tran, Dinh-Phuc; Hsu, Po-Ning; Yang, Shih-Chi; Gusak, A. M.; Tu, K. N.; Chen, Chih
err分享
err收藏
Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-05-01
err3
errOAAI
errYang, Mingkun; Zhao, Xiuchen; Huo, Yongjun; Tu, King-Ning; Liu, Yingxia
err分享
err收藏
Surface protrusion induced by inter-diffusion on Cu-Sn micro-pillars
errMATERIALS & DESIGN
IF7.9
err2022-12-01
err2
errOAAI
errChen, Yang; Dai, Wenjie; Liu, Yingxia; Chen, Chih; Tu, K. N.; Chen, Guang
err分享
err收藏
Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires
errNANO LETTERS
IF9.1
err2022-11-07
err5
PREAI
errWeng, Wei-Lun; Chen, Hsin-Yu; Ting, Yi-Hsin; Chen, Hsin-Yi Tiffany; Wu, Wen-Wei; Tu, King-Ning; Liao, Chien-Neng
err分享
err收藏
Low temperature interfacial reaction in 3D IC nanoscale materials
errMATERIALS SCIENCE & ENGINEERING R-REPORTS
IF26.8
err2022-10-01
err10
PREAI
errLiu, Yingxia; Lu, Yang; Tu, K. N.
err分享
err收藏
Distribution of elastic stress as a function of temperature in a 2-μm redistribution line of Cu measured with X-ray nanodiffraction analysis通过x射线纳米衍射分析测量的Cu的2μm重分布线中弹性应力随温度的分布
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2022-09-01
err3
errOAAI
errHsu, Wei-You; Tseng, I-Hsin; Chiang, Ching-Yu; Tu, K. N.; Chen, Chih
err分享
err收藏

研究方向

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合作学者
合作期刊
D
Dierk Raabe
H 指数: 178 · 论文数: 2.3K
杨
杨旸 (Yang Yang)
H 指数: 161 · 论文数: 716
李菊英 封面图
李菊英 (Ju Li)
H 指数: 147 · 论文数: 1.3K
C
Chun‐Sing Lee
H 指数: 140 · 论文数: 1.4K
Y
Yu Huang
H 指数: 138 · 论文数: 519
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