未登录Annealing and Impurity Effects in Co Thin Films for MOL Contact and BEOL Metallization
Kelly, J.; Kamineni, V.; Lin, X.; Pacquette, A.; Hopstaken, M.; Liang, Y.; Amanapu, H.; Peethala, B.; Jiang, L.; Demarest, J.; Shobha, H.; Raymond, M.; Haran, B. .png)
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收藏Electrodeposited Cu Film Morphology on Thin PVD Cu Seed LayersKelly, J.; Lin, X.; Nogami, T.; van der Straten, O.; Demarest, J.; Li, J.; Murphy, R.; Zhang, X.; Penny, C.; Parks, C.; Edelstein, D. 分享 收藏 Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu InterconnectsKelly, J.; Nogami, T.; van der Straten, O.; Demarest, J.; Li, J.; Penny, C.; Vo, T.; Parks, C.; Dehaven, P.; Hu, C. K.; Liniger, E. 分享 收藏 分享 收藏 分享 收藏 Nanometer-scale arrangement of human serum albumin by adsorption on defect arrays created with a finely focused ion beamBergman, AA; Buijs, J; Herbig, J; Mathes, DT; Demarest, JJ; Wilson, CD; Reimann, CT; Baragiola, RA; Hu, R; Oscarsson, SO 分享 收藏 
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