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J

Jin Yu

Anhui University of Technology

33H指数
147论文数
4.9K被引数
收录论文 31
发表时间
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Doping and Morphological Engineering for Enhancing Electrochemical Properties of Spinel LiMn2O4 Cathode掺杂和形貌工程用于增强尖晶石LiMn₂O₄正极的电化学性能
errJOM
IF2.3
err2025-10-01
err0
PREAI
errWang, Yicun; Guo, Yuhuan; Wang, Zhipeng; Li, Zenghui; Yang, Yang; Yu, Jin; Pei, Xiaodong; Liu, Dongming
err分享
err收藏
A common-normal-based framework for efficient ellipse contact detection in discrete element modelling基于公共法线的椭圆接触高效检测框架离散元建模
errComputers and Geotechnics
IF6.2
err2025-07-31
err0
PREAI
errMing Xia; Longjun Dong; Fengqiang Gong; Jin Yu; Tongming Qu; Y.T. Feng
err分享
err收藏
Structural and electrochemical characterization of spinel LiMn2O4 synthesized from the phosphate-doped Mn3O4由磷酸盐掺杂的Mn3O4合成的尖晶石LiMn2O4的结构和电化学表征
errJournal of Energy Storage
IF9.8
err2025-07-09
err0
PREAI
errYicun Wang; Yang Yang; Zhipeng Wang; Zenghui Li; Xuanning Huang; Jin Yu; Xiaodong Pei; Dongming Liu
err分享
err收藏
Precisely Geometry Controlled Microsupercapacitors for Ultrahigh Areal Capacitance, Volumetric Capacitance, and Energy Density
errCHEMISTRY OF MATERIALS
IF7
err2018-05-22
err55
PREAI
errYoo, Jungjoon; Byun, Segi; Lee, Chan-Woo; Yoo, Chung-Yul; Yu, Jin
err分享
err收藏
Direct formation of a current collector layer on a partially reduced graphite oxide film using sputter-assisted metal deposition to fabricate high-power micro-supercapacitor electrodes
errJOURNAL OF POWER SOURCES
IF7.9
err2016-03-01
err15
PREAI
errByun, Segi; Yu, Jin
err分享
err收藏
Effects of interfacial Al oxide layers: Control of reaction behavior in micrometer-scale Al/Ni multilayers界面Al氧化物层的影响: 控制微米级Al/Ni多层膜中的反应行为
errMATERIALS & DESIGN
IF7.9
err2015-11-01
err12
PREAI
errKuk, Seoung Woo; Yu, Jin; Ryu, Ho Jin
err分享
err收藏
High-Power Supercapacitive Properties of Graphene Oxide Hybrid Films with Highly Conductive Molybdenum Disulfide Nanosheets具有高导电性二硫化钼纳米片的氧化石墨烯杂化薄膜的高功率超级电容特性
errCHEMELECTROCHEM
IF3.5
err2015-09-22
err29
PREAI
errByun, Segi; Sim, Dong Min; Yu, Jin; Yoo, Jung Joon
err分享
err收藏
Stationary self-propagation combustion with variations in the total layer thickness of compression-bonded Ni-sputtered Al foil multilayers压缩结合的Ni溅射铝箔多层膜的总层厚变化的固定自传播燃烧
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2015-03-01
err10
PREAI
errKuk, Seoung Woo; Yu, Jin; Ryu, Ho Jin
err分享
err收藏
Thermopower detection of single nanowire using a MEMS device
errMEASUREMENT
IF5.6
err2014-05-01
err3
PREAI
errShin, Ho Sun; Lee, Joon Sung; Jeon, Seong Gi; Yu, Jin; Song, Jae Yong
err分享
err收藏
Effects of the Al/Ni ratio on the reactions in the compression-bonded Ni-sputtered Al foil multilayerAl/Ni比对压粘Ni溅射铝箔多层膜反应的影响
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2014-03-01
err25
PREAI
errKuk, Seoung Woo; Ryu, Ho Jin; Yu, Jin
err分享
err收藏
Twin-driven thermoelectric figure-of-merit enhancement of Bi2Te3 nanowires
errNANOSCALE
IF5.1
err2014-01-01
err67
PREAI
errShin, Ho Sun; Jeon, Seong Gi; Yu, Jin; Kim, Yong-Sung; Park, Hyun Min; Song, Jae Yong
err分享
err收藏
Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation
errSCRIPTA MATERIALIA
IF5.6
err2013-08-01
err26
PREAI
errKim, S. H.; Yu, Jin
err分享
err收藏
Ligand Conjugation of Chemically Exfoliated MoS2化学剥离的MoS2的配体缀合
errJOURNAL OF THE AMERICAN CHEMICAL SOCIETY
IF15.6
err2013-03-19
err551
errOAAI
errChou, Stanley S.; De, Mrinmoy; Kim, Jaemyung; Byun, Segi; Dykstra, Conner; Yu, Jin; Huang, Jiaxing; Dravid, Vinayak P.
err分享
err收藏
Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints
errINTERNATIONAL JOURNAL OF FATIGUE
IF6.8
err2013-03-01
err7
PREAI
errLee, K. O.; Yu, Jin; Park, T. S.; Lee, S. B.
err分享
err收藏
Recrystallization-induced void migration in electroplated Cu films
errSCRIPTA MATERIALIA
IF5.6
err2012-08-01
err10
PREAI
errKim, Sunghwan; Yu, Jin
err分享
err收藏
Ultrathin Planar Graphene Supercapacitors
errNANO LETTERS
IF9.1
err2011-03-07
err1.2K
PREAI
errYoo, Jung Joon; Balakrishnan, Kaushik; Huang, Jingsong; Meunier, Vincent; Sumpter, Bobby G.; Srivastava, Anchal; Conway, Michelle; Reddy, Arava Leela Mohana; Yu, Jin; Vajtai, Robert; Ajayan, Pulickel M.
err分享
err收藏
A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process
errSCRIPTA MATERIALIA
IF5.6
err2010-09-01
err37
PREAI
errKim, K. H.; Yu, Jin; Kim, J. H.
err分享
err收藏
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints
errACTA MATERIALIA
IF9.3
err2009-10-01
err90
PREAI
errKim, J. Y.; Yu, Jin; Kim, S. H.
err分享
err收藏
Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering
errAPPLIED PHYSICS LETTERS
IF3.6
err2008-03-05
err74
PREAI
errKim, J. Y.; Yu, Jin
err分享
err收藏
Size-dependent thermal instability and melting behavior of Sn nanowires
errAPPLIED PHYSICS LETTERS
IF3.6
err2007-10-23
err79
PREAI
errShin, Ho Sun; Yu, Jin; Song, Jae Yong
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
P
Pulickel M. Ajayan
H 指数: 201 · 论文数: 1.5K
V
Vinayak P. Dravid
H 指数: 121 · 论文数: 1.1K
R
Róbert Vajtai
H 指数: 115 · 论文数: 565
S
Sung‐Hoon Kim
H 指数: 95 · 论文数: 2.4K
黄加兴 封面图
黄加兴 (Jiaxing Huang)
H 指数: 94 · 论文数: 548
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