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J

Jae Jeong Kim

seoul national university

36H指数
336论文数
5.6K被引数
收录论文 150
发表时间
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Comparative study of Sn sensitization and SnOx liquid-phase deposition for Pd activation toward Cu electroless deposition on glass玻璃上铜电镀的Sn敏化和SnOx液相沉积法用于Pd活化的比较研究
errElectrochimica Acta
IF5.6
err2026-08-13
err0
PREAI
errJiseok Lee; Young Geon Kim; Jae Jeong Kim; Jihyun Kim; Taeho Lim
err分享
err收藏
Pretreatments for photoresist-patterned wafer to improve Cu pillar electrodeposition
errJOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
IF6
err2025-05-01
err0
PREAI
errPark, Soo Woong; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Self-assembly of surfactant mixtures for a versatile control of the rate of the heterogeneous reaction: Case study in Cu electrodeposition表面活性剂混合物的自组装，用于控制异质反应的速率: Cu电沉积的案例研究
errCHEMICAL ENGINEERING JOURNAL
IF13.2
err2024-12-01
err0
errOAAI
errShin, Yeong Min; Lee, Jiseok; Lim, Yeon-Su; Kim, Jae Jeong; Jin, Kyeong Sik; Lee, Hee-Young; Cho, Sung Ki
err分享
err收藏
Improved hydrogen gas sensing performance of Pd-Ni alloy thin films
errINTERNATIONAL JOURNAL OF HYDROGEN ENERGY
IF8.3
err2023-04-01
err8
PREAI
errEadi, S. B.; Oh, Jae Sub; Kim, Chaehwan; Sim, Gapseop; Kim, Kwanghee; Kim, Hee Yeoun; Kim, Jae Jeong; Do, Hyeong Rok; Chu, Sung-il; Jung, Seng Hwan; Lee, H. D.
err分享
err收藏
Electrodeposition of Nano-Twinned Cu and their Applications in Electronics纳米孪晶Cu的电沉积及其在电子学中的应用
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-11-04
err11
PREAI
errPark, Soo Woong; Eom, Hui Won; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition用于通过Cu电沉积高速微孔填充的季铵基整平剂
errELECTROCHIMICA ACTA
IF5.6
err2022-07-01
err15
PREAI
errLee, Myung Hyun; Lee, Yoonjae; Kim, Jung Ah; Jeon, Youngkeun; Kim, Myung Jun; Kim, Young Gyu; Kim, Jae Jeong
err分享
err收藏
Modulating the active sites of nickel phosphorous by pulse-reverse electrodeposition for improving electrochemical water splitting通过脉冲反向电沉积调节镍磷的活性位以改善电化学水分解
errAPPLIED CATALYSIS B-ENVIRONMENT AND ENERGY
IF21.1
err2022-07-01
err60
PREAI
errKim, Byung Keun; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Machine learning to electrochemistry: Analysis of polymers and halide ions in a copper electrolyte从机器学习到电化学: 分析铜电解质中的聚合物和卤化物离子
errELECTROCHIMICA ACTA
IF5.6
err2021-12-01
err17
PREAI
errYoon, Young; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Through Silicon Via Filling with Suppression Breakdown of PEG-Br- in Absence of Accelerator在没有促进剂的情况下，通过硅通孔填充抑制PEG-Br-的击穿
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2021-08-26
err7
PREAI
errJeon, Youngkeun; Yoon, Young; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Acid-durable, high-performance cobalt phosphide catalysts for hydrogen evolution in proton exchange membrane water electrolysis
errINTERNATIONAL JOURNAL OF ENERGY RESEARCH
IF4.2
err2021-06-08
err13
errOAAI
errYoon, Young; Kim, Hoyoung; Kim, Soo-Kil; Kim, Jae Jeong
err分享
err收藏
The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs)聚乙烯吡咯烷酮分子量对玻璃通孔 (TGVs) 无缺陷填充的影响
errJOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
IF6
err2021-04-01
err14
PREAI
errJin, Sang Hoon; Yoon, Young; Jo, Yugeun; Lee, SangYul; Moon, HyungSoo; Seok, Seongho; Kim, Myung Jun; Kim, Jae Jeong; Lee, Min Hyung
err分享
err收藏
Impact of Surface Hydrophilicity on Electrochemical Water Splitting表面亲水性对电化学分解水的影响
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2021-03-02
err83
PREAI
errKim, Byung Keun; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Influence of Reducing Agent on Chemical Decomposition of Bis(3-sulfopropyl) Disulfide (SPS) in Cu Plating Bath
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2021-03-01
err6
PREAI
errKim, Tae Young; Lee, Myung Hyun; Byun, Jinuk; Jeon, Hyunwoo; Choe, Seunghoe; Kim, Jae Jeong
err分享
err收藏
Competitive adsorption between bromide ions and bis(3-sulfopropyl)-disulfide for Cu microvia filling
errELECTROCHIMICA ACTA
IF5.6
err2021-02-01
err26
PREAI
errLee, Myung Hyun; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Direct and quantitative study of ceria-SiO2 interaction depending on Ce3+ concentration for chemical mechanical planarization (CMP) cleaning
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2021-02-01
err43
PREAI
errMyong, Kyong Kyu; Byun, Jinuk; Choo, Min-ju; Kim, Hojoong; Kim, Jun Yong; Lim, Taeho; Kim, Jae Jeong
err分享
err收藏
Polyethylene Glycol-Based Single Organic Additive for Through Silicon Via Filling and its Structural Modification Effect
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2021-01-29
err6
PREAI
errSung, Minjae; Lee, Yoonjae; Lee, Myunghyun; Jeon, Youngkeun; Lim, Taeho; Kim, Young Gyu; Kim, Jae Jeong
err分享
err收藏
Superconformal Cobalt Electrodeposition with a Hydrogen Evolution Reaction Suppressing Additive
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2020-12-29
err8
PREAI
errKang, Jungkyu; Sung, Minjae; Byun, Jinuk; Kwon, Oh Joong; Kim, Jae Jeong
err分享
err收藏
Study on the Effect of Forced Convection on Pd Ion Adsorption and Cu Electroless Deposition
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2020-11-18
err1
PREAI
errMyong, Kyong Kyu; Byun, Jinuk; Kim, Byung Keun; Kwon, Ohsung; Cho, Sung Ki; Kim, Jae Jeong
err分享
err收藏
Decomposition of polyethylene glycol (PEG) at Cu cathode and insoluble anode during Cu electrodeposition
errELECTROCHIMICA ACTA
IF5.6
err2020-10-01
err25
PREAI
errKim, Tae Young; Choe, Seunghoe; Kim, Jae Jeong
err分享
err收藏
Proton Sensitive Additive for Cobalt Electrodeposition
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2020-09-03
err10
PREAI
errKang, Jungkyu; Sung, Minjae; Byun, Jinuk; Kwon, Oh Joong; Kim, Jae Jeong
err分享
err收藏

研究方向

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合作学者
合作期刊
J
Jyongsik Jang
H 指数: 84 · 论文数: 360
B
Benjamin J. Wiley
H 指数: 78 · 论文数: 219
J
Jeong Woo Han
H 指数: 70 · 论文数: 463
S
Seung M. Oh
H 指数: 66 · 论文数: 264
T
Tae Young Kim
H 指数: 65 · 论文数: 598
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