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Michael J. Demkowicz

Texas A&M University System

43H指数
207论文数
7.7K被引数
收录论文 87
发表时间
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Bulge testing to analyze adhesion of films on substrates基片上薄膜附着力分析的鼓泡测试
errMechanics of Materials
IF4.1
err2026-03-02
err0
PREAI
errJasdeep Singh; Hooman Rahmani; Sean P. Cooper; Mina Tavakolzadeh; Eric L. Petersen; Michael J. Demkowicz; Ankit Srivastava
err分享
err收藏
Abnormal grain growth driven by high-temperature proton irradiation in nanocrystalline Ni高温质子辐照驱动的纳米晶Ni异常晶粒生长
errNUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
IF1.3
err2026-01-01
err0
PREAI
errXie, Kelvin Y.; Yadav, Digvijay; Cooper, Kenneth; Lu, Yu; Howard, Jana; Hansen, Marcus; Chauhan, Rijul R.; Park, Junghun; Lee, Sunkyung; Park, Yuhyun; Phong, Andrew; Sim, Gi-Dong; Wu, Yaqiao; Shao, Lin; Demkowicz, Michael J.
err分享
err收藏
Shape-Preserving Metallic Gels with Applications as Electrodes for Liquid Metal Batteries保形金属凝胶及其在液态金属电池电极中的应用
errAdvanced Engineering Materials
IF3.3
err2025-08-24
err0
PREAI
errCharles Borenstein; Brady G. Butler; James D. Paramore; Karl T. Hartwig; Michael J. Demkowicz
err分享
err收藏
Reduction of vanadium diffusivity within copper grain boundaries due to enhanced binding
errSCRIPTA MATERIALIA
IF5.6
err2025-03-01
err0
PREAI
errLiu, T. Y.; Sheu, E.; Tavakolzadeh, M.; Williams, D. J.; Baldwin, J. K.; Demkowicz, M. J.
err分享
err收藏
Temperature dependence of vacancy/self-interstitial recombination volumes in copper
errPHYSICAL REVIEW MATERIALS
IF3.4
err2025-02-11
err0
PREAI
errMwungeli, John C.; Liu, Tung Yan; Demkowicz, Michael J.
err分享
err收藏
Deformation and delamination of dynamically bulging bilayered films
errMECHANICS OF MATERIALS
IF4.1
err2025-01-01
err0
PREAI
errSingh, Jasdeep; Srivastava, Ankit; Demkowicz, Michael J.
err分享
err收藏
Mobility of twinning dislocations in copper up to supersonic speeds
errACTA MATERIALIA
IF9.3
err2024-08-01
err0
PREAI
errDuong, Ta; Dingreville, Remi; Demkowicz, Michael J.
err分享
err收藏
Role of slip in hydrogen-assisted crack initiation in Ni-based alloy 725
errSCIENCE ADVANCES
IF12.5
err2024-07-19
err0
errOAAI
errLiu, Mengying; Jiang, Lai; Demkowicz, Michael J.
err分享
err收藏
Reinforcement learning strategy for control of microstructure evolution in phase field models
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2024-01-01
err2
PREAI
errYang, Haiying; Demkowicz, Michael J.
err分享
err收藏
Lamellar decomposition far from thermodynamic equilibrium片晶分解远离热力学平衡
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2024-01-01
err0
PREAI
errYang, Haiying; Demkowicz, Michael J.
err分享
err收藏
Comparing theoretical predictions of radiation-free velocities of edge dislocations to molecular dynamics simulations
errPHYSICAL REVIEW B
IF3.7
err2023-12-04
err2
errOAAI
errBlaschke, Daniel N.; Duong, Ta; Demkowicz, Michael J.
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Resonance with surface waves induces forbidden velocity bands in dislocation glide
errJOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
IF6
err2023-11-01
err5
errOAAI
errDuong, Ta; Demkowicz, Michael J.
err分享
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Minor titanium addition markedly improves the co-deformability of copper-tantalum composites
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2023-06-01
err0
PREAI
errBorenstein, Charles; Butler, Brady G.; Paramore, James D.; Hartwig, Karl T.; Demkowicz, Michael J.
err分享
err收藏
Fragmentation of the edge of a terminated Cu nanolayer within a Nb matrix upon annealing
errSCRIPTA MATERIALIA
IF5.6
err2023-03-01
err2
errOAAI
errSheu, Emmeline; Zhang, Yifan; Kim, Hyosim; Williams, Darrick J.; Baldwin, John Kevin; Demkowicz, Michael J.
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Outgassing of implanted He via short circuit transport along phase and grain boundaries in vapor co-deposited Cu-W nanocomposites
errACTA MATERIALIA
IF9.3
err2022-11-01
err5
errOAAI
errYadav, Digvijay; Chen, Peng; Xiang, Sisi; Wang, Yongqiang; Baldwin, Jon Kevin; Evans, Peter; Williams, Nicholas; Demkowicz, Michael J.; Xie, Kelvin Y.
err分享
err收藏
Quasi-static and dynamic response of a Cu/Nb composite following equal channel angular extrusion
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2022-09-01
err1
errOAAI
errSamuel, A. F.; Levin, Z. S.; Trujillo, C. P.; Fensin, S. J.; Demkowicz, M. J.; Beyerlein, I. J.; Zok, F. W.
err分享
err收藏
Surface coverage-limited hydrogen uptake into nickel under cathodic charging
errCORROSION SCIENCE
IF8.5
err2022-07-01
err7
PREAI
errJiang, Lai; Demkowicz, Michael J.
err分享
err收藏
Shear strain alters the structure and migration mechanism of self-interstitial atoms in copper
errPHYSICAL REVIEW MATERIALS
IF3.4
err2022-05-17
err5
errOAAI
errZhang, B.; Wheatley, C.; Chen, P.; Qian, X.; Demkowicz, M. J.
err分享
err收藏
Persistence of negative vacancy and self-interstitial formation energies in atomistic models of amorphous silicon
errPHYSICAL REVIEW MATERIALS
IF3.4
err2022-01-31
err5
errOAAI
errCleveland, Mack W.; Demkowicz, Michael J.
err分享
err收藏
Toughening of interface networks through the introduction of weak links
errACTA MATERIALIA
IF9.3
err2021-08-01
err11
errOAAI
errChiu, Edwin; Demkowicz, Michael J.; Srivastava, Ankit
err分享
err收藏

研究方向

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合作学者
合作期刊
I
Irene J. Beyerlein
H 指数: 88 · 论文数: 542
A
A. S. Argon
H 指数: 87 · 论文数: 411
C
Christopher A. Schuh
H 指数: 83 · 论文数: 536
A
Amit Misra
H 指数: 82 · 论文数: 535
A
Anthony D. Rollett
H 指数: 79 · 论文数: 625
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