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J

Jin Shang

chinese academy of sciences

21H指数
105论文数
1.5K被引数
收录论文 17
发表时间
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Twin-wire plasma arc additive manufacturing of the Ti-45Al titanium aluminide: Processing, microstructures and mechanical properties
errINTERMETALLICS
IF4.8
err2021-09-01
err35
PREAI
errWang, Lin; Zhang, Yuelong; Hua, Xueming; Shen, Chen; Li, Fang; Huang, Ye; Ding, Yuhan; Zhang, Peilei; Lu, Qinghua; Zhang, Ting; Shang, Jin
err分享
err收藏
Non-uniform patch based face recognition via 2D-DWT
errIMAGE AND VISION COMPUTING
IF4.2
err2015-05-01
err34
PREAI
errHuang, Zheng-Hai; Li, Wen-Juan; Shang, Jin; Wang, Jun; Zhang, Ting
err分享
err收藏
In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy
errSCRIPTA MATERIALIA
IF5.6
err2011-12-01
err12
PREAI
errLi, C. F.; Liu, Z. Q.; Shang, P. J.; Shang, J. K.
err分享
err收藏
Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2011-11-01
err17
PREAI
errZhang, X. F.; Liu, H. Y.; Guo, J. D.; Shang, J. K.
err分享
err收藏
First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010)
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2010-12-01
err13
PREAI
errPang, X. Y.; Liu, Z. Q.; Wang, S. Q.; Shang, J. K.
err分享
err收藏
Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2010-03-01
err5
PREAI
errLiu, Wei; Zhang, Lei; Shang, J. K.
err分享
err收藏
Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2010-03-01
err59
PREAI
errSong, H. Y.; Zhu, Q. S.; Wang, Z. G.; Shang, J. K.; Lu, M.
err分享
err收藏
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2010-01-01
err20
PREAI
errWang, X. J.; Zeng, Q. L.; Zhu, Q. S.; Wang, Z. G.; Shang, J. K.
err分享
err收藏
Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2009-11-01
err12
PREAI
errZhang, X. F.; Guo, J. D.; Shang, J. K.
err分享
err收藏
Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates
errACTA MATERIALIA
IF9.3
err2009-09-01
err132
errOAAI
errShang, P. J.; Liu, Z. Q.; Pang, X. Y.; Li, D. X.; Shang, J. K.
err分享
err收藏
Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2009-06-01
err14
PREAI
errZhang, X. F.; Guo, J. D.; Shang, J. K.
err分享
err收藏
Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu
errSCRIPTA MATERIALIA
IF5.6
err2008-08-01
err36
PREAI
errShang, P. J.; Liu, Z. Q.; Li, D. X.; Shang, J. K.
err分享
err收藏
Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints
errSCRIPTA MATERIALIA
IF5.6
err2008-03-01
err66
PREAI
errShang, P. J.; Liu, Z. Q.; Li, D. X.; Shang, J. K.
err分享
err收藏
Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect
errSCRIPTA MATERIALIA
IF5.6
err2007-09-01
err63
PREAI
errZhang, X. F.; Guo, J. D.; Shang, J. K.
err分享
err收藏
New spectroscopic data, spin-orbit functions, and global analysis of data on the A1Σu+ and b3Πu states of Na2
errJOURNAL OF CHEMICAL PHYSICS
IF3.1
err2007-07-23
err48
PREAI
errQi, P.; Bai, J.; Ahmed, E.; Lyyra, A. M.; Kotochigova, S.; Ross, A. J.; Effantin, C.; Zalicki, P.; Vigue, J.; Chawla, G.; Field, R. W.; Whang, T.-J.; Stwalley, W. C.; Knoeckel, H.; Tiemann, E.; Shang, J.; Li, L.; Bergeman, T.
err分享
err收藏
Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.铜单晶/sn-ag-cu界面的疲劳损伤机理10.1016/j.Msea.2006.07.
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2006-11-01
err34
PREAI
errZhu, Q. S.; Zhang, Z. F.; Shang, J. K.; Wang, Z. G.
err分享
err收藏
Study on tire dynamic cornering properties using experimental modal parameters
errVEHICLE SYSTEM DYNAMICS
IF3.9
err2002-02-01
err6
PREAI
errShang, J; Guan, DH; Yam, LH
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
刘
刘薇 (Wei Liu)
H 指数: 87 · 论文数: 1.0K
R
Robert W. Field
H 指数: 66 · 论文数: 861
张
张婷 (Ting Zhang)
H 指数: 64 · 论文数: 515
W
William C. Stwalley
H 指数: 52 · 论文数: 419
E
E. Tiemann
H 指数: 48 · 论文数: 373
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