Wayne Johnson - Publications, H-index & Citations

Wayne Johnson

thomas jefferson university

46H指数

509论文数

9.8K被引数

收录论文 11

发表时间

J. Robert Gladden Orthopaedic Society Research Grants: What is the Return on Invesments?

JOURNAL OF THE AMERICAN ACADEMY OF ORTHOPAEDIC SURGEONS GLOBAL RESEARCH AND REVIEWS

IF0

2025-11-01

PREAI

Benn, Lancelot; Stephens, Susan; Ehioghae, Mark; Balkissoon, Rishi; Williams, Brendan A.; Lipa, Shaina; Bernstein, David N.; Sokunbi, Gbolabo; Woods, Barrett; Tyler, Wakenda; Brooks, Jaysson; Morgan, Randall C.; Owusu-Akyaw, Kwadwo; Johnson, Wayne; Carson, Eric; Russell, George V.; Mesfin, Addisu

Thermo-physical properties of diamond nanofluids: A review (vol 129, pg 1123, 2019)

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2020-08-01

PREAI

Bahraseman, Hamidreza Ghasemi; Mashali, Farzin; Languri, Ethan Mohseni; Davidson, Jim; Kerns, David; Johnson, Wayne; Nawaz, Kashif; Cunningham, Glenn

Thermo-physical properties of diamond nanofluids: A review

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2019-02-01

PREAI

Mashali, Farzin; Languri, Ethan Mohseni; Davidson, Jim; Kerns, David; Johnson, Wayne; Nawaz, Kashif; Cunningham, Glenn

Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications 高温应用中功率半导体管芯附着的Ag烧结的可靠性

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2017-09-01

118

PREAI

Yu, Fang; Cui, Jinzi; Zhou, Zhangming; Fang, Kun; Johnson, R. Wayne; Hamilton, Michael C.

Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2016-06-01

PREAI

Peacock, Melissa A.; Roy, Chandan K.; Hamilton, Michael C.; Johnson, R. Wayne; Knight, Roy W.; Harris, Daniel K.

Thermal performance of low melting temperature alloys at the interface between dissimilar materials

APPLIED THERMAL ENGINEERING

IF6.9

2016-04-01

PREAI

Roy, Chandan K.; Bhavnani, Sushil; Hamilton, Michael C.; Johnson, R. Wayne; Knight, Roy W.; Harris, Daniel K.

Investigation into the application of low melting temperature alloys as wet thermal interface materials 研究低熔点合金作为湿热界面材料的应用

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2015-06-01

PREAI

Roy, Chandan K.; Bhavnani, Sushil; Hamilton, Michael C.; Johnson, R. Wayne; Nguyen, Jonathan L.; Knight, Roy W.; Harris, Daniel K.

A new approach to designing electronic systems for operation in extreme environments: Part II - The SiGe remote electronics unit

IEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINE

IF3.8

2012-07-01

PREAI

England, T. D.; Diestelhorst, R. M.; Kenyon, E. W.; Cressler, J. D.; Ramachandran, V.; Alles, M.; Reed, R.; Berger, R.; Garbos, R.; Blalock, B.; Mantooth, A.; Barlow, M.; Dai, F.; Johnson, W.; Ellis, C.; Holmes, J.; Webber, C.; McCluskey, P.; Mojarradi, M.; Peltz, L.; Frampton, R.; Eckert, C.

A New Approach to Designing Electronic Systems for Operation in Extreme Environments: Part I - The SiGe Remote Sensor Interface

IEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINE

IF3.8

2012-06-01

PREAI

Diestelhorst, Ryan M.; England, Troy D.; Berger, Richard; Garbos, Ray; Ulaganathan, Chandradevi; Blalock, Ben; Cornett, Kimberly; Mantooth, Alan; Geng, Xueyang; Dai, Foster; Johnson, Wayne; Holmes, Jim; Alles, Mike; Reed, Robert; McCluskey, Patrick; Mojarradi, Mohammad; Peltz, Leora; Frampton, Robert; Eckert, Cliff; Cressler, John D.

Packaging Technology for Electronic Applications in Harsh High-Temperature Environments 恶劣高温环境下电子应用的封装技术

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

IF7.2

2011-07-01

PREAI

Hagler, Ping; Henson, Phillip; Johnson, R. Wayne

Flexible Electronic Assemblies for Space Applications

IEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINE

IF3.8

2010-06-01

PREAI

Del Castillo, Linda; Moussessian, Alina; McPherson, Ryan; Zhang, Tan; Hou, Zhenwei; Dean, Robert; Johnson, R. Wayne

研究方向