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S

Seung‐Boo Jung

sungkyunkwan university (skku)

51H指数
504论文数
1.1W被引数
收录论文 117
发表时间
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Sn-3.0Ag-0.5Cu/OSP solder joints assembled using multi-wavelength lightSn-3.0Ag-0.5Cu/OSP焊点采用多波长光组装
errMaterials Today Communications
IF4.5
err2025-07-07
err0
PREAI
errHyo-Won Lee; Eun-Chae Noh; Jong-Woong Kim; Seung-Boo Jung; Jeong-Won Yoon
err分享
err收藏
Rapid-response hybrid piezo-triboelectric pressure sensor using all-fabric materials for enhanced sensing and power generation基于全织物材料的快速响应混合压电-摩擦电压力传感器，用于增强传感和发电
errNANO ENERGY
IF17.1
err2025-07-01
err0
PREAI
errChoi, Su Bin; Veeralingam, Sushmitha; Khanh, Tran Duc; Choi, Jun Sang; Kishore, Kampara Roopa; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
Highly active bayberry-like porous silver microparticles for fabricating sintered silver with dispersed nanopores and adjustable Young's modulus高活性越橘状多孔银微米颗粒，用于制备分散纳米孔和可调杨氏模量的烧结银
errRARE METALS
IF11
err2025-03-21
err1
PREAI
errDong, Bo-Long; Li, Hao-Song; Dong, Chuan-Qi; Li, Xiang-Ji; Zhu, Yi-Chen; Fang, Yi; Fu, Bi-Cheng; Jung, Seung-Boo; Zhu, Wen-Bo
err分享
err收藏
Atmospheric plasma-sintered Cu-MWNT nanocomposite films for enhanced thermal management
errSURFACES AND INTERFACES
IF6.3
err2025-02-01
err0
errOAAI
errJeong, Geon-Joo; Kim, Tae-Yoo; Lee, Changhoon; Jung, Seung-Boo; Kim, Kwang-Seok
err分享
err收藏
Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package Integration
errMATERIALS
IF3.2
err2024-11-13
err0
errOAAI
errChoi, Mikyeong; Kim, Seahwan; Noh, Taejoon; Kang, Donggil; Jung, Seungboo
err分享
err收藏
Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering各种焊接条件下Sn-3.0Ag-0.5Cu焊点的性能: 回流焊与激光与强脉冲光焊接
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-11-01
err0
errOAAI
errNoh, Eun-Chae; Lee, Hyo-Won; Kim, Jong-Woong; Jung, Seung-Boo; Yoon, Jeong-Won
err分享
err收藏
Stretchable Piezoresistive Pressure Sensor Array with Sophisticated Sensitivity, Strain-Insensitivity, and Reproducibility具有复杂灵敏度、应变不敏感性和再现性的可拉伸压阻式压力传感器阵列
errADVANCED SCIENCE
IF14.1
err2024-07-16
err0
errOAAI
errChoi, Su Bin; Noh, Taejoon; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2024-02-07
err1
PREAI
errJeong, Jong-Min; Kim, Dongjin; Kim, Jungsoo; Bang, Junghwan; Jung, Seung-Boo; Kim, Min-Su
err分享
err收藏
A tough, anti-freezing, and low-dehydration rate gelatin hydrogel with inverse temperature-dependent ionic conductivity
errJOURNAL OF MATERIALS CHEMISTRY C
IF5.1
err2024-01-01
err3
PREAI
errSaeed, Aiman; Zaidi, Syed Farrukh Alam; Mun, Junyoung; Cho, Hyung Koun; Jung, Seung-Boo; Lee, Nae-Eung; Park, Chun Gwon; Lee, Jung Heon
err分享
err收藏
Water-Triggered Self-Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing ProcessTi3C2Tx MXene独立电极的水触发自愈: 影响愈合过程的因素的系统检查
errSMALL
IF12.1
err2023-12-28
err1
PREAI
errChoi, Jun Sang; Meena, Jagan Singh; Bin Choi, Su; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
Advances in Silver Nanowires-Based Composite Electrodes: Materials Processing, Fabrication, and Applications
errADVANCED MATERIALS TECHNOLOGIES
IF6.2
err2023-08-03
err17
PREAI
errMeena, Jagan Singh; Choi, Su Bin; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
Self-Repairing and Energy-Harvesting Triboelectric Sensor for Tracking Limb Motion and Identifying Breathing Patterns
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2023-06-09
err17
PREAI
errMeena, Jagan Singh; Khanh, Tran Duc; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
Electronic textiles: New age of wearable technology for healthcare and fitness solutions
errMATERIALS TODAY BIO
IF10.2
err2023-04-01
err58
errOAAI
errMeena, Jagan Singh; Choi, Su Bin; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
Intense Pulsed Light Soldering of Sn-3.0Ag-0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface-Finished Printed Circuit Board and Its Drop Impact Reliability
errADVANCED ENGINEERING MATERIALS
IF3.3
err2023-02-15
err6
PREAI
errHa, Eun; Min, Kyung Deuk; Lee, Sinyeob; Hwang, Jae-Seon; Kang, Taegyu; Jung, Seung-Boo
err分享
err收藏
Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene NanosheetsTi3AlC2 MAX相中氧在Ti3C2-Based MXene纳米片的氧化物形成和导电性中的作用
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2023-02-02
err15
PREAI
errChoi, Su Bin; Oh, Jung-Min; Meena, Jagan Singh; Kwon, Hanjung; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
Recent progress of Ti3C2Tx-based MXenes for fabrication of multifunctional smart textiles
errAPPLIED MATERIALS TODAY
IF6.9
err2022-12-01
err27
PREAI
errMeena, Jagan Singh; Choi, Su Bin; Jung, Seung-Boo; Kim, Jong-Woong
err分享
err收藏
High-temperature stability of Ni-Sn intermetallic joints for power device packaging
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2022-01-01
err5
PREAI
errJeong, So-Eun; Jung, Seung-Boo; Yoon, Jeong-Won
err分享
err收藏
Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu-Ni bonding添加Cu和Ni的Sn-3.0Ag-0.5Cu焊料的混合瞬态液相烧结连接用于cu-ni连接
errAPPLIED SURFACE SCIENCE
IF6.9
err2021-06-01
err13
PREAI
errMin, Kyung Deuk; Lee, Choong-Jae; Hwang, Byeong-Uk; Kim, Jae-Ha; Jang, Jun-Ho; Jung, Seung-Boo
err分享
err收藏
Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2021-05-01
err13
PREAI
errLee, Choong-Jae; Kang, Dong-Gil; Hwang, Byeong-Uk; Min, Kyung Deuk; Joo, Jinho; Jung, Seung-Boo
err分享
err收藏
Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn-58Bi
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2021-03-01
err8
PREAI
errMin, Kyung Deuk; Jung, Kwang-Ho; Lee, Choong-Jae; Hwang, Byeong-Uk; Jung, Seung-Boo
err分享
err收藏

研究方向

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合作学者
合作期刊
N
Nosang V. Myung
H 指数: 64 · 论文数: 429
T
Taek‐Soo Kim
H 指数: 62 · 论文数: 571
N
Nae‐Eung Lee
H 指数: 62 · 论文数: 367
Y
Yutaka S. Sato
H 指数: 60 · 论文数: 493
H
Hiroyuki Kokawa
H 指数: 59 · 论文数: 555
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