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R

Richard C. Alkire

University of California Santa Barbara

48H指数
324论文数
6.8K被引数
收录论文 52
发表时间
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OPTIMIZATION OF ELECTROLYTIC CELLS HAVING LARGE NUMBERS OF VARIABLES
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-09
err6
PREAI
errALKIRE, RC; CERA, GD; STADTHERR, MA
err分享
err收藏
Mechanic study of copper deposition onto gold surfaces by scaling and spectral analysis of in situ atomic force microscopic images
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-07
err133
errOAAI
errSchmidt, WU; Alkire, RC; Gewirth, AA
err分享
err收藏
Influence of Fe-rich intermetallic inclusions on pit initiation on aluminum alloys in aerated NaCl富铁金属间夹杂物对充气NaCl中铝合金凹坑萌生的影响
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err198
PREAI
errPark, JO; Paik, CH; Huang, YH; Alkire, RC
err分享
err收藏
Copper deposition in the presence of surface-confined additives
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err66
PREAI
errEliadis, ED; Nuzzo, RG; Gewirth, AA; Alkire, RC
err分享
err收藏
Confocal microscopy for simultaneous imaging of Cu electrodeposit morphology and adsorbate fluorescence
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err10
PREAI
errChung, DS; Alkire, RC
err分享
err收藏
In situ studies of Cu deposition in the presence of quaternary ammonium salts
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err20
PREAI
errEliadis, ED; Alkire, RC
err分享
err收藏
Effect of benzotriazole on the anisotropic electrolytic etching of copper
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err21
PREAI
errPapapanayiotou, D; Deligianni, H; Alkire, RC
err分享
err收藏
Adsorption of thiourea on copper electrodes monitored by in situ infrared spectroscopy
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err35
PREAI
errPapapanayiotou, D; Nuzzo, RN; Alkire, RC
err分享
err收藏
Scanning microsensors for measurement of local pH distributions st the microscale
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err70
PREAI
errPark, JO; Paik, CH; Alkire, RC
err分享
err收藏
Mathematical Modeling of Electrochemical Systems at Multiple Scales
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-11-05
err2
errOAAI
errAlkire, Richard
err分享
err收藏
Numerical Scaling Studies of Kinetically-Limited Electrochemical Nucleation and Growth with Accelerated Stochastic Simulations
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2014-02-25
err2
errOAAI
errBezzola, Andri; Bales, Benjamin B.; Petzold, Linda R.; Alkire, Richard C.
err分享
err收藏
An exact and efficient first passage time algorithm for reaction diffusion processes on a 2D-lattice用于2d晶格上反应扩散过程的精确有效的首次通过时间算法
errJOURNAL OF COMPUTATIONAL PHYSICS
IF3.8
err2014-01-01
err13
errOAAI
errBezzola, Andri; Bales, Benjamin B.; Alkire, Richard C.; Petzold, Linda R.
err分享
err收藏
Dieter M. Kolb (1942-2011) Obituary
errANGEWANDTE CHEMIE-INTERNATIONAL EDITION
IF16.9
err2011-11-21
err0
errOAAI
errKibler, Ludwig A.; Alkire, Richard C.
err分享
err收藏
Prospects of on-chip fuel cell performance: improvement based on numerical simulation
errENERGY & ENVIRONMENTAL SCIENCE
IF30.8
err2011-01-01
err20
PREAI
errTominaka, Satoshi; Ohta, Sousuke; Osaka, Tetsuya; Alkire, Richard
err分享
err收藏
Additive-Assisted Nucleation and Growth by Electrodeposition I. Experimental Studies with Copper Seed Arrays on Gold Films
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err14
PREAI
errWillis, Matthew; Alkire, Richard
err分享
err收藏
Island Dynamics Algorithm for Kinetically Limited Electrochemical Nucleation of Copper with Additives onto a Foreign Substrate
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err8
PREAI
errStephens, Ryan M.; Alkire, Richard C.
err分享
err收藏
Additive-Assisted Nucleation and Growth by Electrodeposition II. Mathematical Model and Comparison with Experimental Data
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err8
PREAI
errStephens, Ryan M.; Willis, Matthew; Alkire, Richard C.
err分享
err收藏
A hybrid multiscale kinetic Monte Carlo method for simulation of copper electrodeposition模拟铜电沉积的混合多尺度动力学蒙特卡罗方法
errJOURNAL OF COMPUTATIONAL PHYSICS
IF3.8
err2008-05-01
err46
PREAI
errZheng, Zheming; Stephens, Ryan M.; Braatz, Richard D.; Alkire, Richard C.; Petzold, Linda R.
err分享
err收藏
Effect of additives on shape evolution during electrodeposition - III. Trench infill for on-chio interconnects
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2008-01-01
err25
PREAI
errQin, Yan; Li, Xiaohai; Xue, Feng; Vereecken, Philippe M.; Andricacos, Panayotis; Deligianni, Hariklia; Braatz, Richard D.; Alkire, Richard C.
err分享
err收藏
Effect of additives on shape evolution during electrodeposition - II. Parameter estimation from roughness evolution experiments
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2007-01-01
err51
PREAI
errRusli, Effendi; Xue, Feng; Drews, Timothy O.; Vereecken, Philippe M.; Andricacos, Panos; Deligianni, Hariklia; Braatz, Richard D.; Alkire, Richard C.
err分享
err收藏

研究方向

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合作期刊
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H 指数: 84 · 论文数: 496
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D
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H 指数: 80 · 论文数: 778
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