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M

M.Z. Abdullah

universiti sains malaysia

45H指数
429论文数
8.1K被引数
收录论文 95
发表时间
Semiconductor wafer warpage in electronics packaging: a hybrid investigation with ML and experimental insights电子封装中的半导体晶圆翘曲:结合机器学习与实验洞察的混合研究
err2025-12-20
err0
PREAI
errKrishnamoorthy Ramalingam; Mohd. Zulkifly Abdullah; Mohamad Aizat Abas; Kok Hwa Yu; Roslan Kamarudin; Muhammad Razi Abdul Rahman; Shaw Fong Wong; Pooi Kit Lam; Bok Eng Cheah
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Cutting-edge developments in active and passive photovoltaic cooling for reduced temperature operation用于降低温度操作的主动和被动光伏冷却的前沿发展
err2024-09-01
err7
errOAAI
errSohail, Aamir; Rusdi, Mohd Syakirin; Waseem, Muhammad; Abdullah, Mohd Zulkifly; Pallonetto, Fabiano; Sultan, Sakhr M.
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Revolutionizing photovoltaic excellence: Unveiling a cutting-edge approach to assessing module enhancers for optimal area and cost efficiency
err2024-03-01
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errOAAI
errSultan, Sakhr M.; Tso, C. P.; Ajeel, Raheem K.; Sobayel, K.; Abdullah, M. Z.; Sopian, K.; Al Busaidi, Ahmed Said
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Influence of oxyhydrogen gas retrofit into two-stroke engine on emissions and exhaust gas temperature variations
errHELIYON
IF3.6
err2024-03-01
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errOAAI
errKamarudin, R.; Ang, Y. Z.; Topare, N. S.; Ismail, M. N.; Mustafa, K. F.; Gunnasegaran, P.; Abdullah, M. Z.; Mazlan, N. M.; Badruddin, I. A.; Zedan, A. S. A.; Baig, R. U.; Sultan, S. M.
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An economic feasibility assessment of implementing photovoltaic module reflectors under Malaysian meteorological conditions
err2024-02-09
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errOAAI
errSultan, Sakhr M.; Abdullah, M. Z.; Tso, C. P.; Abllah, N. F. Nik; Zakaria, N.; Ajeel, Raheem K.; Sobayel, K.
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Development of assessment methods for photovoltaic module enhancing techniques using the lifespan parameter
errHELIYON
IF3.6
err2023-11-01
err1
errOAAI
errSultan, Sakhr M.; Tso, C. P.; Sopian, K.; Ajeel, Raheem K.; Sobayel, K.; Ibrahim, A.; Abdullah, M. Z.
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A Detailed Analysis of the Modified Economic Method for Assessing the Performance of Photovoltaic Module Enhancing Techniques
err2023-08-05
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errSultan, Sakhr M. M.; Tso, C. P.; Ajeel, Raheem K. K.; Sobayel, K.; Abdullah, M. Z.
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Numerical investigation on rheology models during encapsulation of moulded underfill (MUF) for flip-chip package
err2023-05-19
err2
PREAI
errAzmi, Muhammad Afiq; Abdullah, Mohd Zulkifly; Shuib, Raa Khimi; Ariff, Zulkifli Mohamad; Loh, Wei Keat; Ooi, Renn Chan; Ooi, Chun Keang; Abdullah, Muhammad Khalil
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Viscosity and rheological behavior of Al2O3-Fe2O3/water-EG based hybrid nanofluid: A new correlation based on mixture ratio
err2023-04-01
err57
PREAI
errWanatasanappan, V. Vicki; Kanti, Praveen Kumar; Sharma, Prabhakar; Husna, N.; Abdullah, M. Z.
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An experimental investigation of shear strength and adhesion on the chip-substrate joint in LED packaging
err2022-12-01
err1
PREAI
errAlim, Md. Abdul; Aziz, Mohd Sharizal Abdul; Abdullah, M. Z.; Kamarudin, R.; Lee, J. R.; Rusdi, M. S.; Khor, C. Y.
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Influence of Nanoparticles on Thermophysical Properties of Hybrid Nanofluids of Different Volume Fractions
err2022-07-27
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errOAAI
errAbdullah, Mohd Zulkifly; Yu, Kok Hwa; Loh, Hao Yuan; Kamarudin, Roslan; Gunnasegaran, Prem; Alkhwaji, Abdusalam
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