logo
科言猫学术研究的AI总结
language
手机端手机端
  • Phone Feature微信小程序
简体中文简体中文
notice消息通知
博客博客
delete
arrow
返回
H

Hideki Takagi

National Institute of Advanced Industrial Science and Technology

33H指数
345论文数
4.3K被引数
收录论文 36
发表时间
logo
Electrical conductance at Ga2O3/Si interfaces fabricated via surface activated bonding通过表面激活键合制备的Ga₂O₃/Si界面的电导率
errJOURNAL OF APPLIED PHYSICS
IF2.5
err2025-10-14
err0
errOAAI
errMatsumae, Takashi; Kurashima, Yuichi; Nemoto, Ryoichi; Sasaki, Kohei; Suyama, Atsushi; Yokota, Kazuhiro; Takagi, Hideki
err分享
err收藏
Au hollow pyramidal bumps for low-temperature low-pressure bonding fabricated via Au film transfer method通过金薄膜转移法制备的低温低压键合用Au空心金字塔凸点
errsensors and actuators a physical
IF0
err2025-08-13
err0
PREAI
errShintaro Goto; Kai Takeuchi; Le Hac Huong Thu; Takashi Matsumae; Hideki Takagi; Yuichi Kurashima; Eiji Higurashi
err分享
err收藏
Room temperature bonding of Au plating through surface smoothing using polyimide template stripping使用聚酰亚胺模板剥离通过表面平滑进行Au镀层的室温键合
errSENSORS AND ACTUATORS A-PHYSICAL
IF4.9
err2025-03-01
err0
PREAI
errTakeuchi, Kai; Koseki, Shogo; Thu, Le Hac Huong; Matsumae, Takashi; Takagi, Hideki; Kurashima, Yuichi; Tsuda, Takahiro; Tokuhisa, Tomoaki; Shimizu, Toshikazu; Higurashi, Eiji
err分享
err收藏
Low-temperature bonding of HCl-dipped Ge substrate with diamond heat-spreader through atomically thin layer
errMATERIALIA
IF2.9
err2025-03-01
err0
PREAI
errMinowa, Yuki; Matsumae, Takashi; Kurashima, Yuichi; Takagi, Hideki; Hayase, Masanori
err分享
err收藏
Micropatterning process of diamond substrates by stamping Ni imprint molds通过压印Ni imprint模具对金刚石基板进行微图案化处理
errDIAMOND AND RELATED MATERIALS
IF5.1
err2025-02-01
err0
PREAI
errMatsumae, Takashi; Nishimori, Hiroaki; Kurashima, Yuichi; Takagi, Hideki
err分享
err收藏
Ultra-High Vacuum Cells Realized by Miniature Ion Pump Using High-Efficiency Plasma Source
errSENSORS
IF3.5
err2024-06-20
err0
errOAAI
errKurashima, Yuichi; Maeda, Atsuhiko; Oshima, Naoto; Motomura, Taisei; Matsumae, Takashi; Watanabe, Mitsuhiro; Takagi, Hideki
err分享
err收藏
High-Efficiency Plasma Source Using a Magnetic Mirror Trap for Miniature-Ion Pumps
errSENSORS
IF3.5
err2023-01-16
err3
errOAAI
errKurashima, Yuichi; Motomura, Taisei; Yanagimachi, Shinya; Matsumae, Takashi; Watanabe, Mitsuhiro; Takagi, Hideki
err分享
err收藏
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging
errSENSORS
IF3.5
err2022-10-24
err1
errOAAI
errMatsumae, Takashi; Kariya, Shingo; Kurashima, Yuichi; Thu, Le Hac Huong; Higurashi, Eiji; Hayase, Masanori; Takagi, Hideki
err分享
err收藏
An Ultra-Compact MEMS Pirani Sensor for In-Situ Pressure Distribution Monitoring
errMICROMACHINES
IF3
err2022-10-07
err3
errOAAI
errZhang, Lan; Lu, Jian; Takagi, Hideki; Matsumoto, Sohei; Higurashi, Eiji
err分享
err收藏
Room temperature bonding of GaN and diamond substrates via atomic layer
errSCRIPTA MATERIALIA
IF5.6
err2022-07-01
err15
PREAI
errMatsumae, Takashi; Kurashima, Yuichi; Takagi, Hideki; Shirayanagi, Yusuke; Hiza, Shuichi; Nishimura, Kunihiko; Higurashi, Eiji
err分享
err收藏
Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
errMICROSYSTEMS & NANOENGINEERING
IF9.9
err2022-01-17
err4
errOAAI
errKariya, Shingo; Matsumae, Takashi; Kurashima, Yuichi; Takagi, Hideki; Hayase, Masanori; Higurashi, Eiji
err分享
err收藏
Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions
errSCIENTIFIC REPORTS
IF3.9
err2021-05-27
err9
errOAAI
errMatsumae, Takashi; Takigawa, Ryo; Kurashima, Yuichi; Takagi, Hideki; Higurashi, Eiji
err分享
err收藏
Heterogeneous GaN-Si integration via plasma activation direct bonding
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2021-01-01
err13
PREAI
errMatsumae, Takashi; Mu Fengwen; Fukumoto, Shoya; Hayase, Masanori; Kurashima, Yuichi; Higurashi, Eiji; Takagi, Hideki; Suga, Tadatomo
err分享
err收藏
Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions
errSCRIPTA MATERIALIA
IF5.6
err2021-01-01
err20
PREAI
errMatsumae, Takashi; Kurashima, Yuichi; Takagi, Hideki; Umezawa, Hitoshi; Higurashi, Eiji
err分享
err收藏
Heterogeneous direct bonding of diamond and semiconductor substrates using NH3/H2O2 cleaning
errAPPLIED PHYSICS LETTERS
IF3.6
err2020-11-17
err11
PREAI
errFukumoto, Shoya; Matsumae, Takashi; Kurashima, Yuichi; Takagi, Hideki; Umezawa, Hitoshi; Hayase, Masanori; Higurashi, Eiji
err分享
err收藏
Room temperature bonding of aluminum nitride ceramic and semiconductor substrate氮化铝陶瓷与半导体基板的室温键合
errCERAMICS INTERNATIONAL
IF5.6
err2020-11-01
err19
PREAI
errMatsumae, Takashi; Kurashima, Yuichi; Higurashi, Eiji; Nishizono, Kazunori; Amano, Tsutomu; Takagi, Hideki
err分享
err收藏
Fully epitaxial giant magnetoresistive devices with half-metallic Heusler alloy fabricated on poly-crystalline electrode using three-dimensional integration technology
errACTA MATERIALIA
IF9.3
err2020-11-01
err11
errOAAI
errChen, Jiamin; Sakuraba, Yuya; Yakushiji, Kay; Kurashima, Yuichi; Watanabe, Naoya; Liu, Jun; Li, Songtian; Fukushima, Akio; Takagi, Hideki; Kikuchi, Katsuya; Yuasa, Shinji; Hono, Kazuhiro
err分享
err收藏
Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding
errMICROMACHINES
IF3
err2020-04-27
err35
errOAAI
errYamamoto, Michitaka; Matsumae, Takashi; Kurashima, Yuichi; Takagi, Hideki; Suga, Tadatomo; Takamatsu, Seiichi; Itoh, Toshihiro; Higurashi, Eiji
err分享
err收藏
Low-temperature direct bonding of β-Ga2O3 and diamond substrates under atmospheric conditions
errAPPLIED PHYSICS LETTERS
IF3.6
err2020-04-09
err71
PREAI
errMatsumae, Takashi; Kurashima, Yuichi; Umezawa, Hitoshi; Tanaka, Koji; Ito, Toshimitsu; Watanabe, Hideyuki; Takagi, Hideki
err分享
err收藏
Hydrophilic low-temperature direct bonding of diamond and Si substrates under atmospheric conditions
errSCRIPTA MATERIALIA
IF5.6
err2020-01-01
err25
PREAI
errMatsumae, Takashi; Kurashima, Yuichi; UmezaWa, Hitoshi; Takagi, Hideki
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
K
K. Hono
H 指数: 120 · 论文数: 1.2K
刘
刘俊 (Jun Liu)
H 指数: 105 · 论文数: 899
J
Jian Lü
H 指数: 103 · 论文数: 1.6K
S
Shinji Yuasa
H 指数: 66 · 论文数: 699
S
Shinichi Takagi
H 指数: 62 · 论文数: 1.0K
查看更多