Shizhao Wang - Publications, H-index & Citations

王诗兆 (Shizhao Wang)

Hainan University

12H指数

32论文数

475被引数

收录论文 13

发表时间

Atomistic bonding and nanoscale separation mechanisms of plasma-activated and hydrated SiCN/SiCN dielectric interfaces for hybrid bonding 等离子体激活和水合SiCN/SiCN介质界面的原子级键合与纳米级分离机制用于混合键合

Applied Surface Science

IF6.9

2026-07-01

PREAI

Li, Dan; Tian, Zhiqiang; Zhou, Wenlan; Ge, Chang; Wang, Xintong; Tian, Zihan; Wang, Shizhao

Experimentally calibrated, thermally activated phase-field modeling of annealing-driven grain growth in TSV-Cu 实验校准的热激活相场模拟：退火驱动的TSV-Cu晶粒生长

Results in Engineering

IF7.9

2026-07-01

PREAI

Wang, Shizhao; Sun, Qimeng; Li, Dan; Tian, Zihan; Xi, Yang; Zhang, Yunpeng; Tang, Feixiang

asKAN: Active subspace embedded Kolmogorov-Arnold network asKAN: 嵌入主动子空间的科尔莫戈罗夫-阿尔诺德网络

Neural Networks

IF6.3

2025-11-02

PREAI

Zhiteng Zhou; Zhaoyue Xu; Yi Liu; Shizhao Wang

Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration 双热处理-化学机械抛光工艺中通孔硅凸起的3D集成研究

MICROSYSTEMS & NANOENGINEERING

IF9.9

2025-02-13

OAAI

Liu, Tianjian; Wang, Shizhao; Dong, Fang; Xi, Yang; Zhang, Yunpeng; He, Tao; Sun, Xiang

Numerical simulation of novel stepped hybrid bonding interface using finite element analysis

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

IF4.6

2025-02-01

PREAI

Ni, Wentao; Sheng, Can; Zhao, Bo; Tian, Zhiqiang; Chen, Min; Wang, Shizhao; Wu, Gai

A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions

MICROMACHINES

IF3

2024-03-23

OAAI

Zhou, Shuai; Ma, Kaixue; Wu, Yugong; Wang, Shizhao; Cai, Nian

Clustering dimensionless learning for multiple-physical-regime systems

COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING

IF7.3

2024-02-01

PREAI

Zhang, Lei; Xu, Zhaoyue; Wang, Shizhao; He, Guowei

Vortices and Forces in Biological Flight: Insects, Birds, and Bats 生物飞行中的涡流和力: 昆虫，鸟类和蝙蝠

ANNUAL REVIEW OF FLUID MECHANICS

IF30.2

2024-01-19

PREAI

Liu, Hao; Wang, Shizhao; Liu, Tianshu

Optimization of Cu protrusion of wafer-to-wafer hybrid bonding for HBM packages application*

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

IF4.6

2022-12-01

PREAI

Wang, Shizhao; Zhang, Hehui; Tian, Zhiqiang; Liu, Tianjian; Sun, Yameng; Zhang, Yuexin; Dong, Fang; Liu, Sheng

Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices

MICROMACHINES

IF3

2022-02-15

OAAI

Zhang, Yuexin; Wang, Shizhao; Dong, Fang; Sun, Yameng; Sheng, Can; Ma, Kun; Tian, Zhiqiang; Qian, Zhengfang; Wong, Chingping; Liu, Sheng

Investigation of electrochemical oxidation technology for selective bromine extraction in comprehensive utilization of concentrated seawater

SEPARATION AND PURIFICATION TECHNOLOGY

IF9

2020-10-01

PREAI

Zhang, Xiao; Ji, Zhi-Yong; Liu, Fu; Zhao, Ying-Ying; Liu, Jie; Wang, Shi-Zhao; Li, Fei; Guo, Xiao-Fu; Wang, Jun; Yuan, Jun-Sheng

Bifurcations of vortex-induced vibrations of a fixed membrane wing at Re 1000

NONLINEAR DYNAMICS

IF6

2017-12-26

PREAI

Sun, Xu; Wang, Shi-Zhao; Zhang, Jia-Zhong; Ye, Ze-Hua

The spanwise spectra in wall-bounded turbulence

ACTA MECHANICA SINICA

IF4.6

2017-12-20

OAAI

Wang, Hong-Ping; Wang, Shi-Zhao; He, Guo-Wei

研究方向