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E

E.H. Wong

Nanyang Technological University

0H指数
0论文数
0被引数
收录论文 16
发表时间
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Derivation of novel creep-integrated fatigue equations
errINTERNATIONAL JOURNAL OF FATIGUE
IF6.8
err2019-11-01
err2
PREAI
errWong, E. H.
err分享
err收藏
The mechanics of bondline thickness in balanced sandwich structures
errINTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
IF3.5
err2017-10-01
err2
PREAI
errWong, E. H.
err分享
err收藏
Creep-integrated fatigue equation for metals
errINTERNATIONAL JOURNAL OF FATIGUE
IF6.8
err2017-05-01
err19
PREAI
errLiu, Dan; Pons, Dirk John; Wong, E. H.
err分享
err收藏
Design analysis of sandwiched structures experiencing differential thermal expansion and differential free-edge stretching
errINTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
IF3.5
err2016-03-01
err6
PREAI
errWong, E. H.
err分享
err收藏
Interfacial stresses in sandwich structures subjected to temperature and mechanical loads
errCOMPOSITE STRUCTURES
IF7.1
err2015-12-01
err11
PREAI
errWong, E. H.
err分享
err收藏
Thermal stresses in the discrete joints of sandwiched structures
errCOMPOSITE STRUCTURES
IF7.1
err2015-07-01
err7
PREAI
errWong, E. H.
err分享
err收藏
A unified equation for creep-fatigue
errINTERNATIONAL JOURNAL OF FATIGUE
IF6.8
err2014-11-01
err27
PREAI
errWong, E. H.; Mai, Y. -W.
err分享
err收藏
Frequency-dependent strain-life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency
errINTERNATIONAL JOURNAL OF FATIGUE
IF6.8
err2014-02-01
err4
PREAI
errWong, E. H.; Seah, S. K. W.; Caers, J. F. J. M.; Lai, Y. -S.
err分享
err收藏
Design features for bobbin friction stir welding tools: Development of a conceptual model linking the underlying physics to the production process
errMATERIALS & DESIGN
IF7.9
err2014-02-01
err94
PREAI
errSued, M. K.; Pons, D.; Lavroff, J.; Wong, E. H.
err分享
err收藏
Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending
errINTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
IF9.4
err2009-02-01
err20
PREAI
errWong, E. H.; Wong, C. K.
err分享
err收藏
Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
errSCRIPTA MATERIALIA
IF5.6
err2008-12-01
err22
PREAI
errSeah, S. K. W.; Wong, E. H.; Shim, V. P. W.
err分享
err收藏
DNA sensing by silicon nanowire: Charge layer distance dependence
errNANO LETTERS
IF9.1
err2008-03-01
err277
PREAI
errZhang, Guo-Jun; Zhang, Gang; Chua, Jay Huiyi; Chee, Ru-Ern; Wong, Ee Hua; Agarwal, Ajay; Buddharaju, Kavitha D.; Singh, Navab; Gao, Zhiqiang; Balasubramanian, N.
err分享
err收藏
Direct measurement of cure-induced stress in thermosetting materials by means of a dynamic mechanical analyzer
errMACROMOLECULAR RAPID COMMUNICATIONS
IF4.3
err2006-08-07
err18
PREAI
errYu, Hong; Mhaisalkar, Subodh G.; Wong, Ee Hua
err分享
err收藏
Observations of gelation and vitrification of a thermosetting resin during the evolution of polymerization shrinkage
errMACROMOLECULAR RAPID COMMUNICATIONS
IF4.3
err2005-09-05
err33
errOAAI
errYu, H; Mhaisalkar, SG; Wong, EH
err分享
err收藏
Tungsten 1996
errCOORDINATION CHEMISTRY REVIEWS
IF23.5
err1998-05-01
err1
PREAI
errWong, EH
err分享
err收藏
A COMMENT ON THE CLASSIFICATION AND NOMENCLATURE OF PHENCYCLIDINE AND SIGMA-RECEPTOR SITES
errTRENDS IN NEUROSCIENCES
IF15.1
err1988-09-01
err5
PREAI
errKEMP, JA; FOSTER, AC; WONG, EHF; MIDDLEMISS, DN
err分享
err收藏

研究方向

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合作期刊
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麦亦勇 (Yiu‐Wing Mai)
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S
Subodh G. Mhaisalkar
H 指数: 103 · 论文数: 626
张刚 封面图
张刚 (Gang Zhang)
H 指数: 83 · 论文数: 898
Z
Zhiqiang Gao
H 指数: 66 · 论文数: 667
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