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B
Byungwhan Kim
Sejong University
22
H指数
213
论文数
1.6K
被引数
0
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30
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被引数
Use of Speckle Pattern for Monitoring Thermal Energy Behavior of Battery Cathode
使用散斑图案监测电池阴极的热能行为
JOURNAL OF THE OPTICAL SOCIETY OF KOREA
IF
0
2016-06-25
2
PRE
AI
Kim, Byungwhan; Jang, Junyoung
分享
收藏
Exponentially weighted moving average-based procedure with adaptive thresholding for monitoring nonlinear profiles: Monitoring of plasma etch process in semiconductor manufacturing
EXPERT SYSTEMS WITH APPLICATIONS
IF
7.5
2013-10-01
13
PRE
AI
Jeong, Young-Seon; Kim, Byungwhan; Ko, Young-Don
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Design and VLSI implementation of a high-performance face detection engine
COMPUTERS & ELECTRICAL ENGINEERING
IF
4.9
2012-09-01
3
PRE
AI
Han, Dongil; Choi, Jongho; Kim, Byungwhan; Cho, Jae Il
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收藏
Use of neural network to in situ conditioning of semiconductor plasma processing equipment
APPLIED SOFT COMPUTING
IF
6.6
2012-02-01
3
PRE
AI
Kim, Byungwhan; Kim, Daehyun
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Room Temperature Deposition Process for Manufacturing Silicon Nitride Films Using Pulsed Plasma and Neural Network
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2011-10-01
3
PRE
AI
Kim, Daehyun; Kim, Byungwhan; Han, Dongil; Yoon, Neung Goo
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Neural network modeling of inter-characteristics of silicon nitride film deposited by using a plasma-enhanced chemical vapor deposition
EXPERT SYSTEMS WITH APPLICATIONS
IF
7.5
2011-09-01
7
PRE
AI
Lee, Su Jin; Kim, Byungwhan; Baik, Sung Wook
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In-situ monitoring of plasma equipment using spectrophotometric colorimetry and neural network
CHEMOMETRICS AND INTELLIGENT LABORATORY SYSTEMS
IF
3.8
2011-05-01
1
PRE
AI
Kim, Byungwhan; Kwon, Minji
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Use of Neural Network and Genetic Algorithm to Model Scanning Electron Microscopy for Enhanced Image of Material Surfaces
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2011-04-11
5
PRE
AI
Kim, Byungwhan; Kim, Daehyun; Baik, Sung Wook; Lee, Sang Bum; Kim, Dong Hwan
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Optimization of Wavelet-Filtered In-Situ Plasma Etch Data Using Neural Network and Genetic Algorithm
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2011-04-11
7
PRE
AI
Kim, Byungwhan; Kim, Daehyun; Han, Dongil; Lee, Nae-Il
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In-Situ Leak Detection of Plasma Processing Chamber Using Neural Network and Optical Emission Spectroscopy
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2011-01-31
7
PRE
AI
Kim, Byungwhan; Kwon, Minji; Kim, Daehyun; Baik, Sung Wook; May, Gary S.; Jung, Jaehoon; Woo, Bongju
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Optimization of Transmittance Characteristic of Indium Tin Oxide Film Using Neural Networks
METALS AND MATERIALS INTERNATIONAL
IF
4
2010-10-26
7
PRE
AI
Kim, Byungwhan; Lee, Su Jin; Min, Chul Hong; Kim, Tae Seon
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Room temperature, ion energy-controlled deposition of silicon nitride films in a SiH4-N2 plasma
METALS AND MATERIALS INTERNATIONAL
IF
4
2010-08-26
0
PRE
AI
Kim, Byungwhan; Kwon, Minji; Seo, Yong Ho
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Growth of silicon nitride film by controlling plasma ion energy and duty ratio at room temperature
METALS AND MATERIALS INTERNATIONAL
IF
4
2010-08-26
0
PRE
AI
Kim, Byungwhan; Lee, Sujin
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收藏
Functional Kernel-Based Modeling of Wavelet Compressed Optical Emission Spectral Data: Prediction of Plasma Etch Process
IEEE SENSORS JOURNAL
IF
4.5
2010-03-01
9
PRE
AI
Ko, Young-Don; Jeong, Young-Seon; Jeong, Myong-Kee; Garcia-Diaz, Alberto; Kim, Byungwhan
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Optimization of optical lens-controlled scanning electron microscopic resolution using generalized regression neural network and genetic algorithm
EXPERT SYSTEMS WITH APPLICATIONS
IF
7.5
2010-01-01
19
PRE
AI
Kim, Byungwhan; Kwon, Sanghee; Kim, Dong Hwan
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In-Situ Detection of Plasma Processing Equipment Using a V-Mask Control Chart
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2009-12-21
1
PRE
AI
Baik, Sung Wook; Kim, Woosuk; Kim, Byungwhan
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Use of neural network to model X-ray photoelectron spectroscopy data for diagnosis of plasma etch equipment
EXPERT SYSTEMS WITH APPLICATIONS
IF
7.5
2009-10-01
4
PRE
AI
Kim, Byungwhan; Kim, Jeong; Choi, Seongjin
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Neural Network Model of Plasma Charging Damage on MOSFET Device
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2009-04-06
1
PRE
AI
Kim, Byungwhan; Lee, Hwa Jun; Kim, Donghwan
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Statistical Characterization of Process-Induced Plasma Damage
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2009-04-06
1
PRE
AI
Kim, Byungwhan; Kwon, Sang Hee; Kwon, Kwang Ho; Baek, Kyu-Ha; Lee, Jin Ho; Kim, Dong Hwan; May, Gary S.
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Use of adaptive network fuzzy inference system to predict plasma charging damage on electrical MOSFET properties
EXPERT SYSTEMS WITH APPLICATIONS
IF
7.5
2009-04-01
5
PRE
AI
Kim, Byungwhan; Kwon, Hee Ju; Choi, Seongjin
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研究方向
暂时未获取到该数据
合作学者
合作期刊
S
Sung Wook Baik
H 指数: 67 · 论文数: 297
D
Dong‐Hwan Kim
H 指数: 59 · 论文数: 459
D
Daehyun Kim
H 指数: 51 · 论文数: 262
Y
Yongho Seo
H 指数: 41 · 论文数: 218
S
Su Jin Lee
H 指数: 39 · 论文数: 281
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