未登录
分享
收藏
分享
收藏Image-based microstructural simulation of thermal conductivity for highly porous wood fiber insulation boards 3D imaging, microstructure modeling, and numerical simulations for insight into structure-property relation
Andra, Heiko; Dobrovolskij, Dascha; Engelhardt, Max; Godehardt, Michael; Makas, Michael; Mercier, Christian; Rief, Stefan; Schladitz, Katja; Staub, Sarah; Trawka, Karol; Treml, Sebastian
分享
收藏
分享
收藏
分享
收藏
分享
收藏