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P. J. Reucroft

机构信息待补充

30H指数
171论文数
3.4K被引数
收录论文 13
发表时间
Self-consolidation mechanism of porous-surfaced Ti implant compacts induced by electro-discharge-sintering of spherical Ti powders
err2015-03-12
err9
PREAI
errJo, Y. H.; Kim, Y. H.; Jo, Y. J.; Seong, J. G.; Chang, S. Y.; Reucroft, P. J.; Kim, S. B.; Lee, W. H.
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One-step process for the fabrication of Ti porous compact and its surface modification by enviromnental-electro-discharge-sintering of spherical Ti powders
err2006-04-01
err9
PREAI
errAn, YB; Oh, NH; Chun, YW; Kim, DK; Park, JS; Choi, KO; Eom, TG; Byun, TH; Kim, JY; Byun, CS; Hyun, CY; Reucroft, PJ; Lee, WH
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Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization
err2003-01-01
err21
PREAI
errKo, YK; Jang, JH; Lee, S; Yang, HJ; Lee, WH; Reucroft, PJ; Lee, JG
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X-ray photoelectron spectroscopic studies of surface modified single-walled carbon nanotube material
err2001-09-01
err142
PREAI
errLee, WH; Kim, SJ; Lee, WJ; Lee, JG; Haddon, RC; Reucroft, PJ
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Formation mechanism of titanium silicide by mechanical alloying
err2001-01-01
err14
PREAI
errByun, CS; Bopark, S; Kim, DK; Lee, W; Hyun, CY; Reucroft, PJ
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Diffusion barrier and electrical characteristics of a self-aligned MgO layer obtained from a Cu(Mg) alloy film
err2000-10-02
err55
PREAI
errLee, WH; Cho, HL; Cho, BS; Kim, JY; Nam, WJ; Kim, YS; Jung, WG; Kwon, H; Lee, JH; Lee, JG; Reucroft, PJ; Lee, CM; Lee, EG
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Factors affecting passivation of Cu(Mg) alloy films
err2000-01-01
err47
PREAI
errLee, W; Cho, H; Cho, B; Kim, J; Kim, YS; Jung, WG; Kwon, H; Lee, J; Reucroft, PJ; Lee, C; Lee, J
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