未登录
分享
收藏One-step process for the fabrication of Ti porous compact and its surface modification by enviromnental-electro-discharge-sintering of spherical Ti powders
An, YB; Oh, NH; Chun, YW; Kim, DK; Park, JS; Choi, KO; Eom, TG; Byun, TH; Kim, JY; Byun, CS; Hyun, CY; Reucroft, PJ; Lee, WH
分享
收藏
分享
收藏
分享
收藏
分享
收藏
分享
收藏
分享
收藏
分享
收藏
分享
收藏
分享
收藏
分享
收藏Diffusion barrier and electrical characteristics of a self-aligned MgO layer obtained from a Cu(Mg) alloy film
Lee, WH; Cho, HL; Cho, BS; Kim, JY; Nam, WJ; Kim, YS; Jung, WG; Kwon, H; Lee, JH; Lee, JG; Reucroft, PJ; Lee, CM; Lee, EG
分享
收藏Factors affecting passivation of Cu(Mg) alloy films
Lee, W; Cho, H; Cho, B; Kim, J; Kim, YS; Jung, WG; Kwon, H; Lee, J; Reucroft, PJ; Lee, C; Lee, J
分享
收藏